Abrisa Technologies to Feature Products & Services at SPIE Defense, Secutity & Sensing 2011
Abrisa Technologies an ISO 9001 and ITAR registered company is a global leader in thin film optical coatings, custom glass fabrication, and specialty glass products. Abrisa Technologies will be participating in the 2011 SPIE Defense, Security & Sensing Exhibition to be held in Orlando, Florida, at the Orlando World Center Marriott Resort & Convention Center on April 25th through 29th. To learn...
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Sodick to Feature High Technology at Eastec in Booth #1205
Sodick Inc., will be featuring its latest innovative technology in Brooks Associates Booth #1205 at Eastec 2011, including the AG40L Sinker EDM and the AG600L Wire EDM. The AG40L Sinker EDM features high speed and high acceleration linear motor drives, this enables even and natural flushing condition that leads to perfect part accuracy. The AG40L can reduce EDMing time by as much as 50%. The...
Read More »Discover Mazak - Canada Event Aims for the Competitive Edge in Manufacturing
Florence, Kentucky - The Discover Mazak - Canada event at the Mazak Canadian Headquarters and Technology Center promises to be one that will give solid competitive advantages to those companies involved in manufacturing. As part of that opportunity, attendees will learn how to secure new work, gain useful insight into maintaining current work and discover how the Canadian Government can help grow...
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Integrated Metal adds State-of-the-Art Capital Equipment
Integrated Metal - a high-precision contract manufacturer- is pleased to announce the installation of its first Amada EML K laser/turret press. This new machine significantly increases sheet metal and light plate processing capacity with its high speed 4 kW laser, faster material handling and 60 x 120 work envelope. The 33 ton turret punch is fully integrated into the design of the machine and...
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Reducing Risk Through On-Demand Manufacturing
Check out this white paper to learn how putting manufacturing safeguards in place stimulates growth and reduces risk in your supply chain.
Read More »Specialty Coating Systems to Exhibit Parylene Coatings at Avionics Europe 2011
(Indianapolis, Indiana) - Specialty Coating Systems (SCS) is pleased to announce that the company will be exhibiting at Avionics and Defence Electronics Europe 2011, March 16-17 at the M.O.C. Event Centre in Munich, Germany. SCS will be exhibiting Parylene conformal coating services and technologies to the crowd of attendees in Stand D7. In addition to the exhibition, SCS Military Market Manager...
Read More »Panasonic Electronic Devices Licenses Multi-Layer Resin Board ALIVH Technology to AT&S
Osaka - Panasonic Electronic Devices Co., Ltd., a Panasonic Group company specialized in manufacturing advanced electronic components, and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a European market leader and one of the largest printed circuit board (PCB) manufacturers in the world, today announced that they have reached an agreement, under which Panasonic will license its...
Read More »PCB Substrate is designed for LED module applications.
Tlam(TM) SS LLD is thermally-conductive PCB substrate that allows for heat dissipation in bright and ultra-bright LED module applications. Product features copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric, which provides electrical isolation, thermal transfer, and adhesion layer for substrate. Standard constructions are made with 1 or 2 oz copper and...
Read More »Mechatronics Module enables development of custom actuators.
Featuring 3.3 V input voltage for battery-powered operation, M3 Micro-Mechatronic Module Design Platform yields complete closed-loop actuator on PCB measuring 12 x 30 mm or less. No external control board is necessary; serial commands drive on-board PID controller using standard I2C, SPI, or USART interface. Typical specifications for linear drive system based on M3 Design Platform include 0.5...
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HDI Flex Circuits offer microvia capability.
Minimizing layer count and circuit size, High Density Interconnect Flexible Circuits feature blind and buried microvia capability down to 75 microns and trace and space capabilities down to 50 microns. Minimum core dielectric thickness is 25 microns and minimum copper thickness is 9 microns. Copper via fill is available.
Read More »PHY and MAC Card supports LTE or WiMAX applications.
Providing complete Digital Base Band design, Model AMC-2C87W3 includes L1 PHY, L2 RLC/MAC, S1/X2 interface, and security processing. WinPath3 Network Processor from Wintegra supports symmetrical multi-processing with 12 DataPath cores and 64 parallel hardware threads, while 2 TI TCI6487 multi-core DSPs running at 1.2 GHz deliver power required for single sector 10 MHz, 2x2 MIMO LTE system. Xilinx...
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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