Latest FPGA Board from VadaTech Comes with Two 8 GB of 64-Bit DDR4 Memory
Utilizes Xilinx XCZU29DR RFSoC and is compliant to AMC.1, AMC.2, AMC.3 and AMC.4 specifications. Includes 16 ADC (12-bit @ 2 GSPS) and 16 DAC (14-bit @ 6.4 GSPS) with analog I/O routed to a MicroRTM, together with clock and trigger I/O, per MTCA.4. Front panel provides DisplayPort, dual USB, RS‑232 ports for CPU and management, and dual high-density connector for external I/O (total of 128...
Read More »
New PMIC Reference Designs Offered in 35-ball BGA with 0.8mm Pitch Packages
Delivers up to 20A total output current and feature independent dynamic voltage scaling. Speeds the development of power supplies for variety of industrial and computing applications, including motor control, machine vision cameras, PLCs, home gateways, portable medical and wireless equipment. Ideal for powering the multiple supply rails of Xilinx Artix-7 FPGAs, Spartan-7 FPGAs and Zynq-7000...
Read More »
New Embedded IoT Solutions for Edge Computing
PIC and AVR MCU development boards with rapid prototyping tool developed in collaboration with AWS, help designers connect IoT sensor nodes to the AWS IoT core service via Wi-Fi. ATSAMA5D27-WLSOM1 integrates the SAMA5D2 MPU, WILC3000 Wi-Fi and Bluetooth combo module powered by the MCP16502 high performance PMIC. SAM-IoT WG connects the google cloud IoT core with 32-bit SAM-D21 Arm® Cortex® M0+...
Read More »New Facility in Thailand Manufactures RF Microelectronic Assemblies and Products
Ramps production while minimizing delays and costs associated with consignment of major manufacturing assets. Supports rapid growth for new technology products across the networking, 5G, data center, automotive/LIDAR and aerospace and defense markets. Clean room provides sterile production environment required for key aspects of optical and microelectronics production.
Read More »
6 Reasons to Consider Hydroforming over Traditional Metal Stamping
To learn more about the functions of the hydroforming process, the key differences from other processes, and why it is preferable over other stamping options, download this eBook now.
Read More »
New (A/D) Converter Circuit Provides Stable Performance Over a Wide Temperature Range
Designed to boost the performance of ΔΣ A/D converters for stable performance under the harsh conditions required for automotive semiconductor devices. High-speed, high-precision operation with a signal bandwidth of 15 MHz and dynamic range of 74.3 dB is achieved when operating at an oversampling frequency of 480MHz. Reduces the operating frequency to one-fourth the previous frequency.
Read More »
New AMC573 FPGA Board is AMC.1, 2, 3 and 4 Compliant
Utilizes the Xilinx XCZU28DR RFSoC and comes with onboard re-configurable FPGA which interfaces directly to the AMC FCLKA, TCLKA-D. Includes Trig-in, Trig-out, clock inputs, dual USB, dual serial ports and connector for external I/O. Features front panel that incorporates 18 high-density RF Coaxial connectors routed to the 8 ADC (12-bit @ 4 GSPS) and 8 DAC (14-bit @ 6.4 GSPS).
Read More »
OKI Delivers Flexible Printed Circuit Board (FPC) for Tomo-e Gozen at the University of Tokyo Kiso Observatory
New observation system for 105 cm Schmidt telescope TOKYO, November 14, 2019 -- OKI Electric Cable Co., Ltd., the OKI Group's electric wire and cable manufacturing company, today announced it has delivered a flexible printed circuit board(*1) ("FPC" hereinafter) to Kiso Observatory, Institute of Astronomy, School of Science, the University of Tokyo (located in Kiso-gun, Nagano Prefecture;...
Read More »
StratEdge Offers Assembly Services to Maximize Power Output of High Frequency Devices
Offers services for attaching gallium nitride and other high-frequency, high-power devices using gold-tin and gold-silicon onto CMC tabs. Optimizes chip performance and provides an effective way to dissipate heat to avoid overheating and failures during normal operation. Creates reliable solder joint with good thermal dissipation.
Read More »
New VPX580 Provides 8GB DDR4 via 64-Bit Wide Memory Channel
Coupling real-time processing capability with high speed I/O. Suitable for radar, signal intelligence and image processing applications. Includes 64 GB of Flash, 128 MB of Boot Flash and SD Card option.
Read More »
New Packaging and Assembly Services Includes Ribbon Bonding Capability
Provides automatic and manual wedge wire bonding. Full packaging as well as chip-on-tab where StratEdge provides the heat spreading tabs. Specializes in RF and microwave devices, including GaN and gallium arsenide.
Read More »
TPA Motion Introduces New Curved Linear Rail Guides: the CR40 Series
For the ultimate in precision open and closed loop guided motion systems, TPA Motion is the leader in curved rail, liner guides. We specialize in engineering excellence, with products that exhibit an elevated level of precision, delivering robust performance, even under the most challenging conditions. See our video to learn more.
Read More »
