Process Allows Nanoscale MEMS to be created inside CMOS wafer.
NanoEMS(TM) technology enables construction of nanoscale MEMS (Micro Electro Mechanical Systems) within structure of actual CMOS wafer itself using standard, high-volume CMOS lines. Existing metal layers in CMOS wafer are used to form MEMS structure via standard mask techniques, and Inter Metal Dielectric is etched away using vapour HF. Etching uses equipment already available for volume...
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Quick Release & Spring Loaded Pins - Fast, Convenient and Secure
To learn more about the different types of pins available or which ones to select for your specific application, download our product guide.
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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)
Fiber Reinforced Polymers (FRP), represents a truly groundbreaking advancement in structural reinforcement. Lightweight, strong, and green, they are changing the way the construction industry thinks about rebar. Unlike steel, FRPs don't rust and are far stronger than standard rebar. To learn why Fiber Reinforced Polymers are poised to change the way the world builds, see our video.
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