New Low Flow Indicator with Maximum Operating Pressure of 6.9bar (100psi)
Provides visual indication of flow between 0.3 and 4 liters per minute. Available in brass or reinforced nylon materials in sizes 1/4”, 3/8” and ½” in NPT or BSPP. Suitable for use inside critical, restricted cooling paths such as injection mold cooling lines with bubblers or baffles.
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Electronic Coating Technologies Introduces Parylene Coatings
Expands Service Offering with Parylene Conformal Coating and IS013485 Certification Mississauga, Ontario, Canada - July 26, 2022, Electronic Coating Technologies (ECT), a leading provider of protective materials and application services for the electronics industry is pleased to announce parylene coating services will now be offered out of the Clifton Park, New York location to serve North...
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Joining Technologies Expands Services to Include Resistance Welding
East Granby, Connecticut, August 3, 2021 – Joining Technologies, an innovator in advanced electron beam and laser beam welding (LBW) applications, has incorporated resistance welding into the company’s scope of precision joining services. Resistance welding, also known as spot welding, is unique in that it joins materials using electrical currents and pressure with no filler material. Spot...
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RD Rubber Technology Corporation is Pleased to Announce A New Product Featuring Rubber to Metal Bonding Produced by Compression Molding
Santa Fe Springs, CA -- RD Rubber Technology Corporation is pleased to announce a new product featuring rubber to metal bonding produced by compression molding. “Compression molded rubber parts are valuable in a range of industries and applications” stated Greg Sallee, RD Rubber’s President. “The manufacturing process is ideal for low and medium-volume production runs and is capable of...
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The Ultimate Guide To Electro-Mechanical Assemblies & Box Builds
This ebook provides an in-depth guide to electro-mechanical assemblies and box builds.
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New SilSo Clear 21002 with Non-Yellowing Properties
Resistant to ultraviolet (UV), temperature and moisture enables material to perform under environmental conditions. Low viscosity and fast curing makes it ideal for pour-in-place or injection molding. Ideal for optical applications such as lenses, light guides and LEDs.
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New Riser Card Supports AMD and NVIDIA MXM 3.1 GPU Modules
Features 8-pin power connector with 4 HDMI ports and a 2-pin fan connector. Designed for use with MXM3 AMD or NVIDIA graphics cards via PCI Express 3.0 bus interface. Suitable for desktops, industrial PC's, military computers and on-board computer infrastructures.
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Penn Color's penneffex™ Sparks Inspiration and Innovation in Consumer Goods Packaging Design
(Doylestown, PA, Date 2020) – Penn Color’s penneffex™ delivers a high-end, eye-catching finish for FMCG packaged products. With nearly unlimited customization options, the penneffex™ line combines Penn Color’s creativity, expertise in colors and special effects and knowledge in manufacturing processes, to inspire creative brand design ideas in product categories such as home care,...
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NEXE Announces Commercialization Plans for its Fully Compostable Nespresso®-Compatible Pod
Vancouver, BC, Feb. 11, 2021 /PRNewswire/ - NEXE Innovations Inc. ( NEXE or the Company ) (TSXV:NEXE), is pleased to announce that the construction of its proof of concept Nespresso Coffee Automation Line is now complete. NEXE's manufacturing partners began factory testing the machine with the company expecting to take delivery of the machine on time and on budget in Q1 2021. NEXE recently...
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Smith Metal Products Announces 3D Binder-jet Metal Printing for Quick-turn Prototype MIM-Like Parts
Center City, Minnesota: Smith Metal Products adds quick-turn 3D Binder-Jet Metal Printing parts for customers to evaluate and verify their product run utilizing a MIM-like process without the cost of building a test mold. Now manufacturers can easily see, touch and evaluate comparable prototype MIM-like parts produced on Smith Metals advanced 3D Binder-Jet Metal Printing additive production...
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Latest 3U VPX FPGA Board Comes with 100G Ethernet
Aligned with Sensor Open Systems Architecture™ (SOSA) technical standard. Includes embedded ARM cores within Zynq Ultrascale+ system-on-chip. Ideal for military/aerospace and commercial applications.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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