Suntron Corporation Highlights Mission Critical Defense Services in Podcast

PHOENIX, AZ - Suntron Corporation, a leader in integrated electronics manufacturing systems (EMS), highlights its capabilities for mission critical defense applications in its latest podcast. Featuring Suntron's Vice President of Sales and Marketing, Michael Seltzer, the podcast discusses Suntron's unique defense capabilities, why Nadcap is different from other certifications, and where he sees...

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Stäubli Connectors to Exhibit at PLASTEC South 2013

StÃ-¤ubli Connectors is a leader in plastics processing and quick mold change solutions, including mold loading, clamping, energy connection and transfer technology engineered to boost efficiency and productivity. This year at PLASTEC South, taking place March 6 - 7 at the Orange County Convention Center in Orlando, FL, attendees will have the opportunity to experience StÃ-¤ubli's latest...

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Laird Technologies to Attend Strategies in Light 2013

Laird Technologies to Attend Strategies in Light 2013

Company to Showcase Thermal Interface Materials St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will attend Strategies in Light 2013. The event will take place at the Santa Clara Convention Center in Santa Clara, California,...

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ABB and andyRobot Develop Standard RoboScreen Packs, Available Q2 2013 for Entertainment and Commercial Uses

ABB and andyRobot Develop Standard RoboScreen Packs, Available Q2 2013 for Entertainment and Commercial Uses

Function packages feature five robot and screen size combinations, dedicated software and concert style mixing board for simplified control Â-· Innovative: Transformative robotic entertainment industry technology simplified Â-· Creativity unleashed: From live performance to permanent installations, explore new boundaries Â-· Easy programming: Integration between Maya and ABB's...

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Printed Circuits, Inc. Makes Equipment, Process and Plant Cleanliness Upgrades

Moving from 2012 into 2013 brings a recommitted interest in improving PCi's product and capabilities. Printed Circuits, Inc. (Minneapolis, MN) has made a number of upgrades to improve their products. Items of note are a new die punch, a new conveyorized microetch line, improvements to the lamination layup clean room, and an overhaul of the HVAC system. The new die punch frees up a significant...

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Bare Board Group to Unveil PCB2GO at the IPC APEX Expo in Las Vegas

Largo, FL - Global circuit board supplier, Bare Board Group (BBG) announced today that it will reveal the latest addition to its widely recognized PCB Take-Out campaign in Las Vegas at the IPC Apex Expo, April 12-14, 2011 at Mandalay Bay. BBG Marketing Diva, Tobey Marsicovetere states, We've been considering this addition to our marketing effort for quite awhile and we're excited that it's...

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Panasonic Electronic Devices Licenses Multi-Layer Resin Board ALIVH Technology to AT&S

Osaka - Panasonic Electronic Devices Co., Ltd., a Panasonic Group company specialized in manufacturing advanced electronic components, and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a European market leader and one of the largest printed circuit board (PCB) manufacturers in the world, today announced that they have reached an agreement, under which Panasonic will license its...

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PCB Substrate is designed for LED module applications.

Tlam(TM) SS LLD is thermally-conductive PCB substrate that allows for heat dissipation in bright and ultra-bright LED module applications. Product features copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric, which provides electrical isolation, thermal transfer, and adhesion layer for substrate. Standard constructions are made with 1 or 2 oz copper and...

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Mechatronics Module enables development of custom actuators.

Featuring 3.3 V input voltage for battery-powered operation, M3 Micro-Mechatronic Module Design Platform yields complete closed-loop actuator on PCB measuring 12 x 30 mm or less. No external control board is necessary; serial commands drive on-board PID controller using standard I2C, SPI, or USART interface. Typical specifications for linear drive system based on M3 Design Platform include 0.5...

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HDI Flex Circuits offer microvia capability.

HDI Flex Circuits offer microvia capability.

Minimizing layer count and circuit size, High Density Interconnect Flexible Circuits feature blind and buried microvia capability down to 75 microns and trace and space capabilities down to 50 microns. Minimum core dielectric thickness is 25 microns and minimum copper thickness is 9 microns. Copper via fill is available.

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