Circuit Board Assembly Services

Leadless Ceramic SMT Package meets optoelectronic circuit needs.
Circuit Board Assembly Services

Leadless Ceramic SMT Package meets optoelectronic circuit needs.

JDEC TO-style SMT leadless packages address photonics industry demands for SMT packaging solution asÂ- alternative for standard TO-type packages. SMT packages can be produced for circuits and I/O configurations fully compatible with most JEDEC TO-style window caps, such as TO-8, TO-46, and beyond at operating frequencies up to 10 GHz and higher. Ability to use standard TO-style lids on...

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Laird Technologies to Attend Strategies in Light 2013
Circuit Board Assembly Services

Laird Technologies to Attend Strategies in Light 2013

Company to Showcase Thermal Interface Materials St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will attend Strategies in Light 2013. The event will take place at the Santa Clara Convention Center in Santa Clara, California,...

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ABB and andyRobot Develop Standard RoboScreen Packs, Available Q2 2013 for Entertainment and Commercial Uses
Circuit Board Assembly Services

ABB and andyRobot Develop Standard RoboScreen Packs, Available Q2 2013 for Entertainment and Commercial Uses

Function packages feature five robot and screen size combinations, dedicated software and concert style mixing board for simplified control Â-· Innovative: Transformative robotic entertainment industry technology simplified Â-· Creativity unleashed: From live performance to permanent installations, explore new boundaries Â-· Easy programming: Integration between Maya and ABB's...

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Circuit Board Assembly Services

Printed Circuits, Inc. Makes Equipment, Process and Plant Cleanliness Upgrades

Moving from 2012 into 2013 brings a recommitted interest in improving PCi's product and capabilities. Printed Circuits, Inc. (Minneapolis, MN) has made a number of upgrades to improve their products. Items of note are a new die punch, a new conveyorized microetch line, improvements to the lamination layup clean room, and an overhaul of the HVAC system. The new die punch frees up a significant...

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Circuit Board Assembly Services

Panasonic Electronic Devices Licenses Multi-Layer Resin Board ALIVH Technology to AT&S

Osaka - Panasonic Electronic Devices Co., Ltd., a Panasonic Group company specialized in manufacturing advanced electronic components, and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a European market leader and one of the largest printed circuit board (PCB) manufacturers in the world, today announced that they have reached an agreement, under which Panasonic will license its...

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Circuit Board Assembly Services

PCB Substrate is designed for LED module applications.

Tlam(TM) SS LLD is thermally-conductive PCB substrate that allows for heat dissipation in bright and ultra-bright LED module applications. Product features copper circuit layer and aluminum or copper base plate bonded together with LLD dielectric, which provides electrical isolation, thermal transfer, and adhesion layer for substrate. Standard constructions are made with 1 or 2 oz copper and...

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Circuit Board Assembly Services

Mechatronics Module enables development of custom actuators.

Featuring 3.3 V input voltage for battery-powered operation, M3 Micro-Mechatronic Module Design Platform yields complete closed-loop actuator on PCB measuring 12 x 30 mm or less. No external control board is necessary; serial commands drive on-board PID controller using standard I2C, SPI, or USART interface. Typical specifications for linear drive system based on M3 Design Platform include 0.5...

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Circuit Board Assembly Services

PHY and MAC Card supports LTE or WiMAX applications.

Providing complete Digital Base Band design, Model AMC-2C87W3 includes L1 PHY, L2 RLC/MAC, S1/X2 interface, and security processing. WinPath3 Network Processor from Wintegra supports symmetrical multi-processing with 12 DataPath cores and 64 parallel hardware threads, while 2 TI TCI6487 multi-core DSPs running at 1.2 GHz deliver power required for single sector 10 MHz, 2x2 MIMO LTE system. Xilinx...

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