Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process
Dicing and laser saw systems, together with inspection systems and yield-enhancing software provide revolutionary control and accuracy Flanders, New JerseyÂ- – Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These...
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2008 Optatec Highlights - New Lenses, Express Glass Services and Precision Glass Components
Docter Optics surprised visitors to Stand C28 at this year's with a massive block of optical glass weighing over 200 kg. Nearly a meter wide, 15 cm thick and 69 cm high, this block stands for the extreme dimensions of the components that Docter Optics Express Glass Services can process-typical operations include sawing, milling, boring, grinding and polishing - at its new facility in Triptis,...
Read More »Metal Cutting Band Saw offers travel vise index control.
Powered by 5 hp band drive motor, dual column Model DC-310NC saws rectangles up to 12 X 12 in. and rounds up to 12 in. dia using 1 Â-¼ in. blade. Ergonomically placed control panel has 8-line alphanumeric display with operator-prompting messages for setup and feedback of machine operations. Kerf compensation and multiple indexing are automatically controlled, and numeric controls offer 10...
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The Comprehensive Guide to Photo Chemical Machining
There are many benefits that photo chemical machining can provide for your precision components. Download this white paper, and learn everything you need to know about this versatile process.
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General Pipe Cleaners Presents Lightweight, Powerful JM-1000 Mini-Jet
The lightweight, compact JM-1000 Mini-Jet clears grease, sand, and ice with a high pressure water jet.
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