Electronic Components & Devices

Metal Oxide Varistors range from 60-680 Vrms.

Available in standard sizes from 23-60 mm, single layer Series ZOV handles up to 80 kA of current and more than 4,100 W. Offered in round, square, and dual or triple stacked models, units feature epoxy coating, rigid terminations, or metallized blocks. Flat to slightly positive temperature coefficient for clamping voltage ensures that device will clamp at stated clamping voltage and prevent part...

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PMC Card facilitates addition of GigE networking.

PMC Card facilitates addition of GigE networking.

Offered as air- or conduction-cooled, dual-port PGE2 is powered by Intel 82546EB Gigabit Ethernet (GigE) Controller and simplifies addition of GigE networking into existing VME, cPCI, or PCI embedded systems. Product has 32/64-bit, 33/66 MHz PCI bus; 64 KB FIFO buffer memory per port; and 0 to +50Â-

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VME Card offers synchro/resolver measurement/simulation.

High-density, DSP-based 64CS3 includes 8 separate S/D and 6 separate D/S converter channels with 16-bit resolution, digital velocity outputs and programmable single- and 2-speed operating modes. Along with isolated I/O, product features wrap-around self-test and optional 5 VA Programmable Reference Supply. Accuracy for measurement channels is 1 arc-min, and accuracy for simulation channels is 30...

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PCI Express-to-PCI Bridge supports up to 6 devices.

Fully compliant to PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0, XIO2000 allows seamless bridging between legacy PCI devices to current PCI Express applications without concern over compliance and interoperability issues. Device has x1 lane upstream port connection to PCI Express root complex, providing support for up to 6 x1 PCI endpoint devices on its downstream side. Product is...

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Dipped Radial Capacitors offer tin-lead finish.

Intended for customers exempt from RoHS specifications, TEP Series tantalum radial leaded capacitors are manufactured with flame-retardant coating. Units offer capacitance range of 0.1-330 Â-µF and are offered with wide range of working voltages and case sizes that enable capacitors to accommodate almost any application. Units are available in bulk and tape and reel packaging for automatic...

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Differential Amplifiers drive high-speed ADCs.

Designed for 3.3-5 V DAQ systems, high-gain THS4508 and unity gain stable THS4511 and THS4513 feature fully differential architecture and 5 V single supply operation. Bandwidths range from 1,600-2,000 MHz, with slew rates from 4,900-6,400 V/Â-µs. Suited for operation over -40 to +85Â-

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Low-Latency, 16-Channel ADC provides fully settled data.

Manufactured in 7 x 7 mm QFN-48 package, ADS1258 is fabricated on precision mixed-signal CMOS technology and optimized for multi-channel applications. This 24-bit ADC offers fixed-channel (125 kS/sec data rate) or automatic channel scan (23.7 kS/sec data rate) modes with 20 bits of effective resolution. Along with low latency (42 Â-µs), product features externally accessible output,...

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Pleated Filters absorb odors, light gases, and VOCs.

Approved to UL class 2, OdorGuard Plus 1, 2, and 4 in. Pleated Filters offer adsorbent loadings of 125, 250, and 375 g/ftÂ-² of filter area. Pleats offer equal volumes of 60% activity activated carbon and activated alumina impregnated with 5% potassium permanganate. Blend of adsorbents removes odors, VOCs, and light gases, including ammonia, formaldehyde, hydrogen sulfide, and sulfur dioxide....

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Low-Power ADCs suit space-constrained applications.

Offered in lead (Pb)-free, 8-pin MSOP (3.1 x 3.1 x 1.18 mm) and SOIC packages, MCP3551 and MCP3553 delta-sigma ADCs feature resolutions of 21.9 and 20.6 bits, respectively. They offer integral nonlinearity of 2 ppm typ, power consumption of 0.85 mW max @ 5 V, and output noise as low as 2.5 Â-µVrms. Along with auto calibration for every conversion, MCP3551 and MCP3553 have -40 to +125Â-

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Solder Redefined
Sponsored

Solder Redefined

Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.

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