Stamped Heatsinks cool high-power LED lighting.
Available in 3 power ratings of 100, 150, and 200 Watts, Igloo SS Series features rectangular profile and provides up to 0.53-
Read More »Jaro's New Embedded Skive Coolers are Super Cool
Applications include Network interface cards, video graphic cards, PCI express & IC spot cooling: customizable fin thickness & pitch. Perfect for low-profile applications... March 2013 BOCA RATON By embedding a leading-edge 50x50x13 mm fan inside of a skived-copper-fin heatsink, Jaro's unique Skive Cooler significantly reduces height requirements for low-profile applications, while providing...
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Heat Sink Screw is designed for GHz BGA socket.
Able to dissipate up to 16 W with additional fan mounted on top, HS-SG-6002 is designed for 31 x 31 to 42.5 x 42.5 mm package size, and also serves as compression mechanism for GHz socket. Constructed with 7075 Aluminum and optimized using fin design, heat sink screw has thermal resistance of 0.530 C/W.
Read More »Novel Concepts, Inc.'s Patented Thermal Superconductor Could Render Computer Fans Obsolete
LAS VEGAS, Feb. 21 -- For over a decade, Novel Concepts, Inc. (http://www.novelconceptsinc.com/) has been on the forefront of thermal management technology, with multiple patents under its belt. Today the company is again breaking ground: Novel Concepts, Inc. has announced IsoSkin(TM), a patented, thin planar thermal superconducting heat spreader with heat transfer performance 20 times greater...
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Custom Progressive Metal Stamping for Manufacturing EMI Shielding
A Guide to Containing EM Radiation Through Custom Progressive Metal Stamping
Read More »Heat Sinks help cool linear LED lighting products.
Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape...
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Heat Sink cools communications processors.
Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7-
Read More »ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...
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Heat Sinks cool Freescale MPC8641D dual-core processors.
Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51-
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Heat Sinks cool components in low air flow conditions.
Measuring 4-7 mm in height, blueICE(TM) Heat Sinks feature thermal resistance as low as 1.23-
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Heat Sinks cool DC/DC converters in low-airflow conditions.
Low-profile powerICE(TM) heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4-7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23-
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ISO-Certified Plastic Injection Molding from Rodon
The Rodon Group is a proven leader in high-volume, close tolerance injection molding. We offer globally competitive, innovative manufacturing solutions for a broad range of industries. Check out our video to learn more.
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