New Wireless SoC Device Offers Security Capabilities and Software Tools
EFR32MG22 features high-performance, low-power 76.8 MHz Arm® Cortex®-M33 core with TrustZone. Available in 5 mm x 5 mm QFN40, 4 mm x 4 mm QFN32 and slender 0.3 mm x 4 mm x 4 mm TQFN32 packages. Application include smart home sensors, lighting controls, and building and industrial automation.
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New Jacinto 7 Processor Platform Includes On-Chip Accelerators
Available in TDA4VM and DRA829V models for ADAS and gateway systems respectively. Offers enhanced deep learning capabilities and advanced networking to solve design challenges in advanced driver assistance systems (ADAS) and automotive gateway applications. Incorporates functional safety microcontroller and support both ASIL-D safety-critical tasks and convenience features with one chip.
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New Tensor Streaming Processor (TSP) Architecture Capable of up to 250 Trillion FLOPS
Provides paradigm for achieving both compute flexibility and massive parallelism without synchronization overhead of traditional GPU and CPU architectures. Support both traditional and new machine learning models, and is currently in operation on both x86 and non-x86 systems. Designed for the performance requirements of computer vision, machine learning and other AI-related workloads.
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THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset
Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc. Tokyo, Japan (August 1, 2019), Santa Clara, CA (July 31, 2019) – THine®, the leader in high-speed serial interfaces and image...
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A Guide to Preventive Maintenance & Refurbishment of Your Tablet Press
Check out this guide to keeping your tablet press in good working order.
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New META-DX1 MACsec Chip is Designed for 5G Mobile Base Station Deployments
Enables line cards to quadruple in capacity up to 14.4 Tbps with 36 ports of 400 GbE or 144 ports of 100 GbE. Secures the traffic leaving the data center or enterprise premises and combines MACsec and FlexE for data center interconnect buildouts. Features an integrated flexible crosspoint switching capability to navigate market transition from 25 Gbps NRZ and 56 Gbps PAM-based architectures.
Read More »Renesas Showcases MPU and MCU Solutions for Changing Real-time, Security and Convenience Demands
Real-time industrial IoT gateway solution collects sensor data from the factory floor and sends it to the cloud for real-time analysis. Secure Chip-to-cloud connectivity over cellular using Synergy™ platform. Also to demonstrate end-to-end solution for next-generation, cloud-based asset tracking with the RX-based LoRa network solution.
Read More »Newly Licensed AI Chip Technology Accelerates Time-to-Market for Customized SoC Solutions
Gyrfalcon Technology Inc. (GTI) is offering the technology powering the company's Lightspeeur® 2801 and 2803 AI accelerators for use in custom SoC designs through a new IP licensing model. . The accelerator chips' architecture features AI cores that are ultra-small and low-power, enabling AI Processing in Memory (APiM) with those cores configured in a proprietary Matrix Processing...
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Latest 112 Gbps SerDes Validation Chip is Fabricated on 7nm FinFET Process Technology
Provide support for range of digital serial communications standards with 1 Gbps to 112 Gbps data rates. Designed for AI/ML, HPC, high-performance network switching for cloud-scale and telco data centers, 5G cellular base stations and edge networking. SerDes receivers are embedded with advanced DSP techniques such as constant modulus algorithm, adaptive equalization and decision-based adaptation.
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SiLC Technologies Silicon Photonics LiDAR Chip Demonstrates Best in Class Energy Efficiency and Camera Safety
Greater than 1,000x lower peak power compared to conventional "Time of Flight" LiDARs in an integrated interference free solution enabling a broad range of applications MONROVIA, Calif., Feb. 28, 2019 /PRNewswire/ -- SiLC Technologies, Inc., a silicon photonics-based provider of integrated 4D vision LiDAR solutions, today announced initial performance results for its integrated FMCW LiDAR...
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New RZ/G2 64-Bit MPUs Designed to Meet Needs of Developers Using Embedded Controllers in Industrial Automation and Building Automation Applications
Will serve as the first reference hardware for Arm64 for the certification and release of CIP Linux packages. Delivers up to 36 percent higher performance than any other embedded 64-bit MPU in the market. Support for the latest high-speed protocols for external memories including LPDDR4 or DDR3L up to 3200 MT/s.
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Solder Redefined
Indium Corporation has developed a new twist on traditional solder by developing a composite with a reinforced matrix internal structure. The result is a solder with increased strength and reliability. Check out this video to learn more about the mechanics behind the groundbreaking technology.
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