New Bluetooth SoC Enables High-Resolution Audio Listening Experiences for Bluetooth Audio Devices
The IS2064GM-0L3 Bluetooth® System-on-Chip Audio System is available in an 8 x 8 mm LGA package. The unit enables manufacturers to develop audio devices with advanced codec. The SoC supports LDAC and audio codec interfaces and the Sony LDAC transmits up to 990 kbps data throughput and maintains a frequency and bit depth of up to 96 kHz/24-bit. The LDAC codec can be integrated into Android 8.0...
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RZ/N1L Solution Kit comes with application programmable interface (API).
RZ/N1L Solution Kit consists of highly integrated RZ/N1L development board, software package with support for EtherCAT®, PROFINET®, and EtherNet/IPTM industrial protocols. RZ/N1L board features two-channel Ethernet port, 32 MB external flash memory, a debug port, push buttons and LEDs and is USB powered. The board acts as reference design for component selection and layout. Kit’s...
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PCL6000 Series Controller Chips Feature Spiral/Helical Interpolation Capabilities
RADFORD, Va. – Nippon Pulse’s PCL6000 series of chip-level controllers – comprised of the two-axis PCL6025B, and the four-axis PCL6045BL and PCL6046 chips – have long been available with highly advanced features, making them the most advanced controller chips in the world. In addition to their standard linear and circular interpolation options, two of our advanced controller chips now...
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Microsemi and Athena Announce the TeraFire Hard Cryptographic Microprocessor for PolarFire
Powerful Data Security Technology Enables High Performance and Low Power for Communications, Defense and Industrial Applications ALISO VIEJO, Calif., April 6, 2017 - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and The Athena Group, Inc. (Athena), a leading provider of security, cryptography,...
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Choosing the Right Type of Chemical Gauge
Understanding the Differences in Chemical Gauges and Their Material Options
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P-Series PLC on Chip features SD card and display interface.
Using EZ ladder programming software and drag-and-drop widgets in the cloud portal, P-Series PLC on a Chip™ allows monitoring, data logging via Ethernet, Wi-Fi, cellular or satellite. With temperature range of -40 to 85°C, chip feature Ethernet communications, SPI ports, 2 CAN ports and Modbus TCP. Communicating serially using Modbus master and slave, counter/timer functionality, device...
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SC2A11A SOC incorporates 24 cores of power-efficient ARM Cortex-A53.
Including Cortex-A53 MPCore 24cores, 1GHz processor, SC2A11A SOC is suitable for data center servers and edge computing in IoT (Internet of Things) systems. Offering DDR4-2133Mbps 64-bit and ECC Memory I/F, device provides optimal CPU balance of performance and power consumption. With UART, I2C, GPIO Serial I/F, unit comes with 2ch 1Gbps LAN wire. Unit offers PCI Express Gen2 and Root/Endpoint...
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MSP430 FRAM microcontroller writes without pre-erase or buffering.
Available in two modes MSP430FR5994 and MSP430FR2111, MSP430 FRAM Microcontrollers offer 256KB FRAM with MSP430FR5994 and unified FRAM memory in small 3x3 mm QFN package with MSP430FR2111. Integrating 10-bit analog-to-digital converter, EEPROM functionality, comparator, real-time clock, enhanced timers, internal oscillator with 16-bit MCU in MSP430FR2111, unit provides ferroelectric RAM and...
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Espressif Licenses and Deploys CEVA Bluetooth in ESP32 IoT Chip
Espressif’s new Wi-Fi/Bluetooth Combo chip leverages RivieraWaves Bluetooth 4.2 dual mode IP MOUNTAIN VIEW, Calif.,Â- - October 26, 2016 - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing IP for smarter, connected devices, today announced Espressif Systems, a leading fabless semiconductor company providing low power wireless solutions for the Internet of Things...
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General Micro Systems to Showcase Rugged COTS C4ISR Systems at Upcoming 2015 AUSA Annual Meeting
25 Years after the DoD’s endorsement of COTS, rugged systems need to focus on SWaP-E: “E” for efficiency in performance, price and I/O density. At AUSA 2015, GMS will showcase over a dozen COTS-ready systems for deployment in new and legacy upgrade C4ISR programs. Shown at the 2015 AUSA Annual Meeting in Washington DC, GMS Booth #2519 Â- • A 65-inch Mission Command Surface", rugged...
Read More »High-Speed/-Resolution Chipset enhances 3D printing, lithography.
Accelerating total exposure, chipset consisting of DLP9000X digital micromirror device and DLPC910 controller delivers streaming pixel speed of >60 Gbps. Being equipped with >4 million micromirrors reduces print head requirements while supporting print feature sizes
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Dies & Stamping Services with Over 25 Years of Experience
PDS is an established leader in progressive die stamping, with a reputation for providing precision and value that dates back more than half a century. Through extensive capabilities and a staff of seasoned professionals, we set the standard for quality, delivering flexible services that can meet the needs of the most challenging requirements. See our video to learn more.
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