On-Chip Network enhances SoC design based on physical synthesis.
Expanding on interleaved multi-channel technology (IMT), SonicsGN-® 3.0 includes layout optimization features for design flows based on physical synthesis as well as place and route tools. SoC designers can eliminate multi-channel DRAM access bottlenecks with IMT and reduce layout tool iterations with flexible user control of hierarchical RTL partitioning and re-timing stage insertion....
Read More »On-Chip Network enhances SoC design based on physical synthesis.
Expanding on interleaved multi-channel technology (IMT), SonicsGNÃ-® 3.0 includes layout optimization features for design flows based on physical synthesis as well as placeÃÂ and route tools. SoCÃÂ designers can eliminate multi-channel DRAM access bottlenecks with IMT and reduce layout tool iterations with flexible user control of hierarchical RTL partitioning and re-timing stage...
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High Voltage Artificial Networks from Teseq Designed for Conducted Emission Testing
HV-AN 150 and HV-AN S150 used in line termination during susceptibility tests for components Teseq introduces two high voltage artificial networks designed for conducted emission tests and line termination during susceptibility tests for components.- The HV-AN 150 and HV-AN S150 are both ideal for use in automotive, military and airborne standards applications. According to Teseq, these two new...
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High Voltage Artificial Networks from Teseq Designed for Conducted Emission Testing
HV-AN 150 and HV-AN S150 used in line termination during susceptibility tests for components Teseq introduces two high voltage artificial networks designed for conducted emission tests and line termination during susceptibility tests for components.Ã- The HV-AN 150 and HV-AN S150 are both ideal for use in automotive, military and airborne standards applications. According to Teseq, these two...
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Prefabricated construction is a type of construction method that involves manufacturing building components off-site or in a controlled environment
Read More »Microsemi and Marvell Collaborate to Simplify Synchronous Ethernet Designs for Packet Switched Networks
Two industry-leading companies come together to provide proven G.8262-compliant solution for faster time to market ALISO VIEJO, Calif. –- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Marvell (NASDAQ:MRVL)-a worldwide leader in providing complete silicon solutions from mobile...
Read More »Microsemi and Marvell Collaborate to Simplify Synchronous Ethernet Designs for Packet Switched Networks
Two industry-leading companies come together to provide proven G.8262-compliant solution for faster time to market ALISO VIEJO, Calif. –Ã- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Marvell (NASDAQ:MRVL)-a worldwide leader in providing complete silicon solutions from mobile...
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HMIC-Based Integrated Bias Network covers 2-18 GHz applications.
Suitable for DC biasing of PIN diode control circuits, MABT-011000 fully monolithic broadband SMT bias network functions as RF-DC de-coupling network as well as DC return and contains series DC blocking capacitor. Design allows use of DC currents up to 60 mA and DC voltages up to 50 V, and use of HMIC process ruggedizes bias network. At 12 GHz, properties include 0.15 dB insertion loss, 60 dB...
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HMIC-Based Integrated Bias Network covers 2-18 GHz applications.
Suitable for DC biasing of PIN diode control circuits, MABT-011000 fully monolithic broadband SMT bias network functions as RF-DC de-coupling network as well as DC return and contains series DC blocking capacitor. Design allows use of DC currents up to 60 mA and DC voltages up to 50 V, and use of HMIC process ruggedizes bias network. At 12 GHz, properties include 0.15 dB insertion loss, 60 dB...
Read More »On-Chip Network improves memory subsystem support and QoS.
SonicsGN™ v2.2 on-chip network IP improves support for memory subsystems and promotes performance with bandwidth allocation across multiple SoC flows. Incorporated memory subsystem and non-blocking concurrency technologies enable support for DDR4 and LPDDR4 memories for both compute and communication traffic on multi-core SoCs. Features fully support multi-threading capabilities of OCP...
Read More »On-Chip Network improves memory subsystem support and QoS.
SonicsGN™ v2.2 on-chip network IP improves support for memory subsystems and promotes performance with bandwidth allocation across multiple SoC flows. Incorporated memory subsystem and non-blocking concurrency technologies enable support for DDR4 and LPDDR4 memories for both compute and communication traffic on multi-core SoCs. Features fully support multi-threading capabilities of OCP...
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Dies & Stamping Services with Over 25 Years of Experience
PDS is an established leader in progressive die stamping, with a reputation for providing precision and value that dates back more than half a century. Through extensive capabilities and a staff of seasoned professionals, we set the standard for quality, delivering flexible services that can meet the needs of the most challenging requirements. See our video to learn more.
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