RF Sockets suit devices with pitches as low as 0.40 mm.
High-frequency center probe test sockets can be mounted to, and removed from, test board because of 4-point, solderless, pressure-mount compression spring probes. Sockets are offered in device packages up to 13 mmÃ-², 14-27 mmÃ-², 28-40 mmÃ-², and 41-55 mmÃ-². With -55 to +150Ã-
Read More »Test Socket suits devices from 28 to 40 mm-².
Designed for manual testing of devices with pitches down to 0.40 mm, CSP test socket provides minimal signal loss for high bandwidth capability via signal path of 1.95 mm. Solderless, pressure-mount compression spring probes allow device to be easily mounted to and removed from test board. Measuring 77.47 x 63.50 x 32.28 mm, sockets have contact forces of 16 g per contact for 0.40 mm pitch and 25...
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