Electronic Components & Devices

Digital Media Processors operate between 300 and 600 MHz.

Based on TMS320C64x+(TM) core, DaVinci(TM) TMS320DM643x Processors provide 32 Kb L1P cache/SRAM, 32 Kb or 80 Kb L1D and 64 or 128 Kb L2 cache/SRAM memory, and asynchronous 8-bit wide EMIF to support NOR flash and NAND flash interfaces. Video processing subsystem integrates preview engine, resizer, and on-screen display accelerator. Peripherals include 10/100 Ethernet MAC, UARTs, I2C, SPI, GPIO,...

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Ultracapacitor Module suits systems requiring up to 1,500 V.

Based on 2.7 V BOOSTCAPÂ-® MC3000 power cells, BOOSTCAPÂ-® HTM BMOD0063-P125 module is designed for braking energy recuperation and torque assist systems in hybrid bus/truck drive trains and electric rail vehicles. Incorporating balancing, monitoring, and thermal management, 125 V module sustains continuous current of up to 150 A in high-temperature environments. Measuring 315 x 425 x 744...

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Mezzanine Card suits ultra-thin data center interconnects.

Designed for use with Fulcrum FocalPoint switch reference design, extended reach CX4 mezzanine card enables OEMs to attain up to 40 m of reach on up to 24 ports of 10 Gigabit Ethernet. Equipped with QLx4300 lane manager chips that actively remove impairments and compensate for channel loss, mezzanine card allows use of ultra-thin 30 gauge CX4 cabling.

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LVDS SerDes Chipsets feature embedded clock architecture.

Eliminating need for second oscillator, Model DS90UR241 serializer and DS90UR124 deserializer chipset serializes 24 bits of data over single differential pair (2 wires) at data rate of 1.03 Gbps. SerDes chipset drives high-quality video data over 10 m of cable. Features include random data lock feature that enables quick recovery from datastream disruptions, at-speed BIST link diagnostics, and...

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Mezzanine Card is designed for Serial RapidIO interconnects.

Available as reference design and ready-to-manufacture solution, Model ZLE(TM)60400 optical extender card reduces complexity of optically enabled line cards used in signal processing, networking, and communications equipment. It delivers up to 25 Gb/sec of ATCA and microTCA system interconnect in hot pluggable, standard AMC form factor. Standalone solution can be used with off-the-shelf...

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Design Kit helps integrate flex circuits into application.

Design Kit helps integrate flex circuits into application.

Flex Circuit Design Kit offers tools and information to assist users from inception to physical mock-up. Start-up guide provides details of flex circuit process including design guidelines, specifications, and manufacturing, along with illustrations and descriptive call-outs, plus instructions on how to build flex circuit mock-up. Kit also includes 2 sheets of .010 in. polyester film to make...

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PCI-to-PCI Bridge supports 4 PCI bus master devices.

Available in 128-pin, 23 x 17 mm PQFP package, small-form-factor Model Tsi340(TM) targets new and existing board footprints that use 32-bit, 66 MHz PCI-to-PCI bridges. Device is 3.3 V I/O and 5 V tolerant, and fully compliant with PCI Local Bus Specification Revision 2.3. It is suited for communications and network equipment, video capture cards, embedded video recorders, multi-function printers,...

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Chelsio Announces Industry's First 10Gb Ethernet Adapters for Unified Wire

Broad Product Family Enables Virtualization of Storage, Clustering and Server Networking SUNNYVALE, Calif., Nov. 14 / -- Chelsio Communications, Inc., the leading provider of 10-Gigabit Ethernet and iSCSI acceleration adapters and ASIC solutions, today announced the industry's first 10Gb Ethernet adapter cards that enable the convergence of storage, clustering, and server networking applications...

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QUALCOMM Brings Broadband Mobility to an Expanded Range of Devices

- Company's New Snapdragon Platform to be a Catalyst for Future Innovation in Computing and Consumer Electronics - SAN DIEGO, Nov. 13 -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced a significant step toward realizing the Company's vision of universal mobility by introducing its Snapdragon(TM)...

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