Electronic Components & Devices

A-Weight Filter works with prepolarized microphones.

Operating from ICPÂ-® sensor power, Â-½ in. in-line Model 426B02 simulates how sound pressure level, at different frequencies, would appear to normal human ear. It can be attached directly to Â-½ in. preamplifier's BNC connector, or between preamplifier and 4-20 mA constant current supply via coaxial cables. Filter is used in testing applications where manufacturers are concerned...

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Diamond Heat Spreaders provide high thermal conductivity.

Available as bare, freestanding diamond segments or in metallized form, DiaTherm(TM) Heat Spreaders are laser cut from sheets of pure diamond formed by chemical vapor deposition in dc torch reactors. They are 100% polycrystalline diamond with density of 3.5 g/cubic-cm and thermal conductivity up to 1,400 W/m-k. Spreaders are suitable mounting structures for laser diodes, laser diode arrays, LEDs...

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Precision Amplifiers operate within -40 to +125-

Fixed-gain differential amplifiers LMP8275, LMP8277, and LMP8276 feature -2 to 27 V input common-mode voltage range and supply voltage range of 4.75-5.5 V. Tri-temperature testing ensures low temperature coefficient for offset voltage drift. Gain is fixed at 20 for high common-mode LMP8275/6 and at 14 for high common-mode bidirectional LMP8277. Low offset voltage of less than 2 mV and offset...

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Mobile Microprocessor is suited for wireless devices.

Featuring 1 GHz processing speed, Scorpion(TM) is designed and optimized for integration into company's Mobile Station Modem(TM) (MSM(TM)) solutions. This ARMv7 architecture-compliant microprocessor, with dynamic voltage and clock scaling, enables convergence of mobile handsets with consumer electronics features. Companion coprocessor implements ARM NEON(TM) technology, providing additional 8...

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Processors allow CD/compressed audio playback from single IC.

Designed for automotive applications, TC94A70FG and TC94A73MFG CD-MP3 processors integrate CD and audio processing features plus 1 Mbit of SRAM and can decode up to 4 audio compression formats. CD servo and RF amplifier control CD spindle, pick-up head laser, and motor driver. Built-in CD DSP performs error correction and demodulation of PCM/EFM signal while compressed audio content is decoded by...

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Flip Chip is designed for wafer bumping applications.

EliteFC(TM), designed for packaging high-temperature power devices, combines advanced thick film under-bump-metallization (UBM) with low-void, lead-free solder paste technology. Offering alternative to thin film sputtered metallization, RoHS-compliant product line is available in various metallurgies and capable of 70 micron pitch packaging geometries. Products suit bumping applications that...

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Graphics Cards are targeted for AGP-based systems.

For systems with accelerated graphics port (AGP), NVIDIAÂ-® GeForce 7800 GS graphics processing unit (GPU) supports MS DirectXÂ-® 9.0 Shader Model v3.0 and high dynamic-range rendering for lighting effects as well as transparency adaptive antialiasing. It incorporates 3G NVIDIA architecture, optimized for MS Windows Vista(TM), with 3D GUI. Card also integrates NVIDIA PureVideo(TM)...

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System-on-Chip Platforms enable TV-audio design.

Featuring DSP code download capability, MSP-M Multistandard Sound Processor is targeted at mid-range to high-end TVs receiving analog or analog/digital broadcast, while MAP-M Multistandard Audio Processor is optimized for TVs that receive digital broadcast only and for consumer audio applications. Both offer Customizable Modular Processing, which enables TV manufacturers to place audio DSP...

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Audio Amplifiers offer mono and stereo capabilities.

Available in 2 mono and 2 stereo versions, with or without mute/enable function, PAM8x02 Series Class-D digital audio amplifiers deliver 2 W into 8 ohm load at less than 10% THD + noise, with efficiencies of over 85%. Only one input coupling capacitor per channel is needed in external circuit. PAM8x01 series of 1.2 W amplifiers includes PAM8301 (mono) and PAM8401 (stereo) Class-D audio...

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