New Electronic Components & Devices Products

HDMI Receiver Chip suits next generation digital TVs.

Designed with DSP technology, Model VTV2320 enables connection of 3 independent HDMI inputs to digital TV. Any 2 of 3 input sources can be selected for simultaneous or parallel HDMI and HDCP decoding and display. By using on-chip digital adaptive equalization, receiver can recover signals error-free from HDMI transmit sources up to 40 m away. Consuming max power of 2.0 W, device incorporates 2...

Serial to Wireless Boards enable wireless networking.

Measuring 54 x 59 mm, EDG-4100W and EDG-4110W are RS-232 or RS-422/485 to WLAN Data Gateway Modules that integrate into legacy OEM serial devices to connect them to wireless Ethernet. Virtual COMport mapping is provided by both modules for communications with host PC through 802.11b wireless network. Along with 230 Kbps transmission speed, modules offer TCP/IP protocol, Microsoft Windows...

RF Power MOSFET operates at dc voltages up to 165 V.

Housed in flangeless T3 package, Model ARF475FL uses 2 die configured for push-pull operation and is capable of 1,000 W pulsed output and 300 CW at up to 150 MHz. To obtain high power dissipation, backside of package is lapped to mate with system heat sink. Coplanar lead arrangement facilitates circuit layout and provides over 2,500 V isolation between any terminal and mounting surface....

RFID Tags and Readers suit Real-Time Location Systems.

Models 433 MHz Mantis Asset Tag and 433 MHz Mantis Reader offer modular design, tag processing and high throughput, simultaneous tag identification, and optional antenna configurations for application-specific coverage. Units are supported by TAVIS data management platform, and are suited for international container tracking, supply chain, and healthcare asset tracking applications.

Hot Forging Process

Check out this white paper to learn about the benefits of hot forging.

Filter Connector withstands thermal shock and vibration.

Featuring Canon CoF technology, filter connector provides standard filtering capabilities including individual isolated pin filtering of high-frequency noise, built-in ground plane barriers in the connector inserts, and filtering at face of system boxes. In MIL-DTL-38999 configurations, it meets MIL-STD and MIL-DTL Series III standard for thermal shock, random vibration, humidity, and high...

Digital Image Processor provides adjustable, HD images.

Designed for real-time image processing, programmable PICTOR is built around vector signal processor with VLIW fixed point arithmetic architecture and parallel processing units (slices). PICTOR slices have separate quad data paths, enabling architecture to achieve processing power of 176 in giga operations at 230 MHz. Along with support for HD resolutions, including 1080i, unit comes with SAD...

PLL Synthesizer offers frequency range of 3,175-3,311 MHz .

Model PSA3240C-LF coaxial resonator oscillator based Phase Locked Loop synthesizer is designed to meet high data rate demand of fixed wireless communication applications as carrier generators. It offers phase noise performance of -95 dBc/Hz @ 10 kHz away from carrier with supply voltage of 5 Vdc, and spurious suppression of -70 dBc. Available in tape and reel packaging for production...

Ikanos Introduces Extended Reach, Low Power 100/100 Mbps VDSL2 Chipsets

Fx(TM)100100-4-EX and Fx(TM)100100S-4-EX VDSL2 Chipsets Extend Range of 100/100 Mbps Service up to 80% and Enable Fan-less Equipment Design FREMONT, Calif., Dec. 6 -- Ikanos Communications, Inc. (NASDAQ:IKAN), a leading developer of Fiber Fast(TM) broadband solutions, today introduced the Fx(TM)100100-4-EX and Fx(TM)100100S-4-EX chipsets for Optical Network Unit (ONU) and Subscriber Located...

NEC Electronics and NEC Corporation Announce Design Sequence to Optimize Multi-Level Interconnects for Applications Using 45-Nanometer CMOS Process Technology

TOKYO, Dec. 6 / -- NEC Electronics Corporation and NEC Corporation today announced the development of an application specific interconnect structure (ASIS) that enables fine tuning of the multi-layer interconnect structure for the various applications in 45 nanometer (nm) CMOS process generation. The companies also verified that by using this technology, the optimal interconnect structure can be...

NEC & NEC Electronics Succeed in Development of Breakthrough Device Technology Capable of Enhancing Functionality of Sub-10nm Transistors

TOKYO, Dec. 6 / -- NEC Corporation (NASDAQ:NIPNY) and NEC Electronics Corporation today announced the joint development of new breakthrough device technology for low-power, high performance system LSI. Based on the ultimate scaling of conventional bulk planar MOSFETs, the new technology is capable of improving on-off ratio, enhancing the functionality of sub-10nm planar bulk transistors. The new...

Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life

For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.