Electronic Components & Devices

Communication Systems

RFMD® Selected to Enable LG's Next-Generation 3G/4G Smartphones

PowerSmart(TM) And WiFi Design Wins Secured In Multiple Devices, Including World's First Full 3D Smartphone BARCELONA, Spain -- RF Micro Devices, Inc. (Nasdaq: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced that RFMD's PowerSmart(TM) power platforms and WiFi front end modules have been...

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Switches

RFMD® Unveils Portfolio of Cellular Front End Modules for 3G/4G Switch and Signal Conditioning Applications

BARCELONA, Spain -- RF Micro Devices, Inc. (Nasdaq: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the addition of four new products to RFMD's expanding portfolio of front end modules for 3G/4G switch and signal conditioning applications. RFMD's switch and signal conditioning product...

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Low-Inductance Ceramic Decoupling Capacitor comes in SnPb version.
Capacitors

Low-Inductance Ceramic Decoupling Capacitor comes in SnPb version.

Available with tin lead (SnPb) termination, LGA Decoupling Capacitor Series comes in 2-terminal package and has 0.47 Â-µF capacitance value. Products are rated at 6 V across -55 to +125°C range and feature X7R, X5R, X7S, or X6S dielectric formations. Multiple case sizes, including 0204, 0306, and 0805, are available for high-speed decoupling in military and aerospace applications in...

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M8 Connectors are overmolded with hexagonal die-cast thread.
Electrical Connectors

M8 Connectors are overmolded with hexagonal die-cast thread.

Featuring knurled and hex locking nut, M8 overmolded connectors can be tightened with torque wrench to ensure proper mating of connecting system. Products have 3, 4, or 6 gold-plated contacts and handle up to 60 V and up to 4 A per contact. When mated properly, connectors are sealed to IP67 rating. Male and female cordsets are available in 2 and 5 m lengths, and mating receptacles and...

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Axial Leaded MLC Capacitor is qualified to AEC-Q200.
Capacitors

Axial Leaded MLC Capacitor is qualified to AEC-Q200.

Available in X7R dielectric, Spinguard® AA Series operate from -55 to +125°C and meet electronic component qualification initiative for automotive applications. Suited for underhood and in-cabin automotive applications, series meets AEC-Q200 level certifications for capacitance values of 0.002 Â-µF, 0.01 µF, and 0.1 µF in 50 and 100 V.

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Power Conversion Diodes offer high efficiency and low EMI.
Rectifiers and Diodes

Power Conversion Diodes offer high efficiency and low EMI.

Qspeed diodes include X Series products designed for applications with switching frequencies below 80 kHz, and Q and H Series units designed for use above 80 kHz. They have low reverse recovery charge and soft recovery waveform, helping designers optimize efficiency and EMI performance of power conversion circuits. Suited for continuous conduction mode boost PFC circuits, 600 V diodes are also...

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Connectors and Couplings bond grounding conductor to enclosures.
Couplings (Fittings)

Connectors and Couplings bond grounding conductor to enclosures.

Constructed with precision-machined brass bodies, steel locknuts, and stainless steel screws, Mighty-Bond(TM) MC Series Connectors and MCC Series Couplings are used to bond grounding electrode conductor to enclosure or raceway. Both Â-½ in. and ¾ in. trade sizes perform in accordance with NEC article 250.8 and are cULus Listed for grounding per UL467. Units are also tamper-resistant...

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Converters

Mode Converter Fiber Coupler uses Gaussian profile fiber input.

Mode Converter Fiber Coupler (MCFC) takes Gaussian profile single-mode fiber input from fiber laser and couples it into Luminator(TM) fiber. Focused spot sizes in range of 60-1,500 Â-µm can be selected by use of appropriate Luminator process tools. Product has detachable output fiber and suits welding applications where profile and small spot size of Gaussian beam are not optimal, such as...

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Modems

Qualcomm Introduces 28nm Mass Market LTE/DC-HSPA+ Chipsets for Mobile Broadband Products

MDM9615 to Support Multi-Mode LTE and MDM8215 to Support Dual-Carrier HSPA+ BARCELONA, Spain, -- Qualcomm Incorporated (Nasdaq: QCOM) today announced two new devices in its family of Mobile Data Modem(TM) (MDM(TM)) chipsets, the MDM9615(TM) and MDM8215(TM). The next generation MDM9615 will support LTE (FDD and TDD), DC-HSPA+, EV-DO Rev-B and TD-SCDMA and the MDM8215 will support DC-HSPA+. These...

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Computers

Qualcomm Announces Next-Generation Snapdragon Mobile Chipset Family

Qualcomm Announces Next-Generation Snapdragon Mobile Chipset Family -- Mobile Technology Leader Debuting New Quad-, Dual- and Single-core Snapdragon Chipsets with a new CPU Architecture -- BARCELONA, Spain, -- Qualcomm Incorporated (Nasdaq: QCOM) today announced its next mobile processor architecture for the Snapdragon family. The new processor micro-architecture, code-named Krait, in the...

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