Mindspeed and CEVA Collaborate to Bring Software-Defined Radio Technology to LTE Wireless Infrastructure Market
Mindspeed Incorporates CEVA-XC323 Communication Processor into its Next-Generation Transcede(TM) eNodeB Solutions for Wireless Base Stations MOUNTAIN VIEW, Calif., Feb. 8, 2011 -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Mindspeed Technologies, Inc. (Nasdaq: MSPD), a leading supplier of semiconductor...
Read More »Mindspeed and CEVA Collaborate to Bring Software-Defined Radio Technology to LTE Wireless Infrastructure Market
Mindspeed Incorporates CEVA-XC323 Communication Processor into its Next-Generation Transcede(TM) eNodeB Solutions for Wireless Base Stations MOUNTAIN VIEW, Calif., Feb. 8, 2011 -- CEVA, Inc. [(Nasdaq: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Mindspeed Technologies, Inc. (Nasdaq: MSPD), a leading supplier of semiconductor...
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Gyratory Sifter combines capacity and performance.
BigMax(TM), with potential for 240 ft-² of screen area in one machine, offers 12 ft of screen deck length to accommodate extended retention time and accurate separations of product. Functionality allows 1-4 separations in single machine, depending on desired deck configuration, and material can be fed at single point or independently to each deck. Also, screens can be replaced from either end of...
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Gyratory Sifter combines capacity and performance.
BigMax(TM), with potential for 240 ftÃ-² of screen area in one machine, offers 12 ft of screen deck length to accommodate extended retention time and accurate separations of product. Functionality allows 1-4 separations in single machine, depending on desired deck configuration, and material can be fed at single point or independently to each deck. Also, screens can be replaced from either...
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Construction Materials for the Future
In this eBook, we highlight some key advantages of Cross-Laminated Timber (CLT) and show why every builder needs to consider adopting this remarkable construction advancement. We'll also introduce you to the latest innovation in CLT, GRIPBlock™, an exciting new technology that will change the way you look at CLT forever.
Read More »Transmit/Receive Processors feature digital pre-distortion.
Intended for 3G and 4G wireless base stations, remote radio heads, and government communication systems, GC533x Series provides up to 148 MHz of fifth order corrected transmit bandwidth with crest factor reduction. Processors include wideband digital up/down convert channels configurable for data rates up to 184 MS/s with 4 fractional re-samplers, 48-bit numerically controlled oscillators, and...
Read More »Transmit/Receive Processors feature digital pre-distortion.
Intended for 3G and 4G wireless base stations, remote radio heads, and government communication systems, GC533x Series provides up to 148 MHz of fifth order corrected transmit bandwidth with crest factor reduction. Processors include wideband digital up/down convert channels configurable for data rates up to 184 MS/s with 4 fractional re-samplers, 48-bit numerically controlled oscillators, and...
Read More »Not Just a Faster Horse: TI's OMAP(TM) 5 Platform Transforms the Concept of 'Mobile'
o New OMAP 5 platform creates disruptive mobile experiences akin to Henry Ford's transformative automobile advancements o Mobile computing, stereoscopic 3D, gesture recognition and computational photography intensified by TI's best-in-class applications platform o Sophisticated multi-core processing, including ARM-® Cortex(TM)-A15 MPCore(TM) processors DALLAS -- Texas Instruments Incorporated...
Read More »Not Just a Faster Horse: TI's OMAP(TM) 5 Platform Transforms the Concept of 'Mobile'
o New OMAP 5 platform creates disruptive mobile experiences akin to Henry Ford's transformative automobile advancements o Mobile computing, stereoscopic 3D, gesture recognition and computational photography intensified by TI's best-in-class applications platform o Sophisticated multi-core processing, including ARMÃ-® Cortex(TM)-A15 MPCore(TM) processors DALLAS -- Texas Instruments...
Read More »Baseband Processor Chip supports Android(TM) smartphones.
Manufactured in 40 nm CMOS process, BCM21654 HSPA Processor integrates ARM Cortex(TM) A9 processor and 3G HSPA modem, which supports 7.2 Mbps of downstream connectivity and 5.8 Mbps upstream, as well as Class 32 EDGE for worldwide roaming. Dual-SIM capabilities allow consumers to use same handset for 2 different phone numbers or accounts. Supporting full-rate video standards such as H.264 at VGA...
Read More »Baseband Processor Chip supports Android(TM) smartphones.
Manufactured in 40 nm CMOS process, BCM21654 HSPA Processor integrates ARM Cortex(TM) A9 processor and 3G HSPA modem, which supports 7.2 Mbps of downstream connectivity and 5.8 Mbps upstream, as well as Class 32 EDGE for worldwide roaming. Dual-SIM capabilities allow consumers to use same handset for 2 different phone numbers or accounts. Supporting full-rate video standards such as H.264 at VGA...
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Standex Engraving Mold-Tech Offers Nickel Shell Capabilities on a Global Scale
Standex Engraving Mold-Tech is the premier, global supplier for mold texturing and surface finishing. With a full range of services, Standex Engraving Mold-Tech is also the only nickel shell supplier producing in three global locations. See our video to learn more.
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