New Electronic Components & Devices Products

Multi-Viewer offers customizable support for 32 mixed inputs.

Supporting mixed HD, SD, analog, and PC signals, MV-3200 Series suits broadcast environments with control rooms that need to monitor variety of signals. Up to 4 input boards and 2 output boards can be installed within 2 RU frame to create multi-viewer with maximum of 32 inputs and 4 display outputs. Up to 32 video windows can be displayed for each output board, and both output boards operate...

TwistMate-® Stainless Steel Connectors from FasTest Facilitate Leak-Proof Sealing Even in Corrosive Environments

Minneapolis, MN-March 8, 2010-FasTest TwistMateÃ-® MIT (internal) and MET (external) connectors now feature stainless steel construction for greater durability and corrosion resistance. TwistMate connectors, previously available in heat-treated black steel, provide a unique seal design that delivers a leak-tight connection to threaded pipe-quickly and without the use of wrenches and thread...

Quad DAC includes internal reference and SPI interface.

Available with 16- or 12-bit resolution and internal 1.25 or 2.048 V reference, Series LTC2654 achieves 16-bit performance of Ã-

PC Card Kits come in snap-on, ultrasonic versions.

Providing complete EMI shielding, PCMCIA RoHS compliant I/O kits include snap-fit model with pair of mechanically-assembled SS card covers that provide PC card with torsional stiffness and optimal drop test performance. With ultrasonic kit, plastic cover set is welded around card ultrasonically to create solid protective shell. Both secure, tamper-proof kits feature standard card end closure...

Choosing the Optimal Electronics Manufacturer

This eBook covers the various factors to consider when selecting an electronics manufacturer, including experience, turnaround times, and more.

Network Media Processor targets DLNA networked devices.

Employing Smart XCode(TM) technology and 1,250 DMIPS dedicated application processor, XCodeÃ-®4111 enables seamless transfer of content across Consumer Electronic devices. Ethernet/WiFi connected devices built around this HD transcoder/encoder can serve as media center controller for conversion and transfer of A/V content between connected devices. Software stacks for DLNA Digital Media...

Fixed Frequency Synthesizer features low phase noise.

Operating in L-band at 1,720 MHz, SFS1720A-LF features typical phase noise of -96 dBc/Hz @ 10 kHz offset and typical sideband spurs of -70 dBc. RoHS-compliant single frequency synthesizer delivers typical output power of 6 dBm with VCO voltage supply of 5 Vdc while drawing 35 mA (typ) and PLL voltage of 3 Vdc while drawing 9 mA (typ) over -40 to +85Ã-

Fixed Frequency Synthesizer features low phase noise.

Operating at 2,365 MHz, Model SFS2365A-LF features typical phase noise of -95 dBc/Hz at 10 KHz offset and typical sideband spurs of -70 dBc. Unit delivers typical output power of 6 dBm with VCO voltage supply of 5 Vdc while drawing 40 mA and phased locked loop voltage of 3 Vdc while drawing 9 mA over temperature range of -40 to 85Ã-

Stick Electrode suits weld overlay hardfacing applications.

Available in 10 and 50 lb boxes and in bulk, SHS 9700E is nanotechnology-based Super Hard SteelÃ-® (SHS) alloy that offers hardfacing alternative to MIG and Open-Arc wire applications. Its ultra-refined, near-nanoscale crystalline microstructure results in hardness up to 70 HRc and exhibits resistance to abrasive wear.

Test Backplane targets VPX board developers/integrators.

Designed to latest VITA 46 specifications, 2-slot VPX test backplane allows user to power up and test J1 fabric connections as they would be interconnected in target application. Unit accepts 6U cards, with 3U size supported by use of shelf divider, and offers slot pitch of 1.6 in. to simplify attachment of probes. Device's A channel input, using SMA cables, accepts up to 10 Gbps and B, C, and D...

Process Allows Nanoscale MEMS to be created inside CMOS wafer.

NanoEMS(TM) technology enables construction of nanoscale MEMS (Micro Electro Mechanical Systems) within structure of actual CMOS wafer itself using standard, high-volume CMOS lines. Existing metal layers in CMOS wafer are used to form MEMS structure via standard mask techniques, and Inter Metal Dielectric is etched away using vapour HF. Etching uses equipment already available for volume...