Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation
Adhesives

Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation

Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation Placing an emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that doesn't require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity. Suitable for a...

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DuPont(TM) Solamet® Helps REC Increase Solar Panel Power Performance
Photovoltaic Equipment

DuPont(TM) Solamet® Helps REC Increase Solar Panel Power Performance

Collaboration on Materials Continues to Enhance Solar Cell Efficiency RESEARCH TRIANGLE PARK, N.C. –Â- DuPont™ Solamet® PV18x series photovoltaic metallization paste is helping REC, a leading global provider of solar energy solutions, to develop its most powerful solar panels to date. The achievement is the result of collaboration over the last four years that has focused on...

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Adhesives

Ellsworth Adhesives Launches New Distribution ERP Software Program

GERMANTOWN, WI – Ellsworth Adhesives, a global distributor of adhesives, specialty chemicals and dispensing equipment, is pleased to announce the successful launch of its new Enterprise Resource Planning (ERP) system platform and enterprise applications. In recognizing the changing needs of customers and increasing demand for solutions to manage business, Ellsworth Adhesives Specialty Chemical...

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Resins

COC Injection Molding Grade Resin has internal mold release.

Formulated to deliver balance of clarity, flow, and processability, TOPAS 5013L-10 cyclic olefin copolymer (COC) resin is intended for injection molding of components for optical, diagnostic, and microfluidic markets. Heat deflection temperature is 127°C, light transmission is 91%, and melt viscosity permits production of ultrathin light guide plates for displays in mobile devices. Product...

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Software

Brady Offers Full Suite of Lockout/Tagout Solutions

Create and maintain a world-class lockout/tagout program with Brady Client Services MILWAUKEE, Wis.Â- – Brady (NYSE:BRC), a global leader in industrial and safety printing systems and solutions, offers complete lockout/tagout solutions as part of its Client Services offerings. Brady Client Services' full suite of lockout/tagout services and software offerings includes procedure writing...

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Radial Shaft Seal protects wind turbines.
Sealants

Radial Shaft Seal protects wind turbines.

Designed with integrated deflector lip, Merkel Radiamatic R 55 Radial Shaft Sealing Ring protects wind turbine systems against harsh environment elements and eliminates need to use second seal, which is common in existing wind systems. In addition, seal minimizes installation space and can even offset radial play or shaft eccentricity without neglecting sealing and deflecting functions.

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Semiconductor Processing Equipment

EV Group Ships Temporary Bonding/Debonding System to Fraunhofer ISIT for Developing Advanced Power Devices

EVG® 850TB/DB product order follows multi-year process development cooperation in thin-wafer applications for PowerMOS and Insulated Gate Bipolar Transistor (IGBT) devices ST. FLORIAN, AustriaÂ- – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the Fraunhofer Institute for...

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Heaters

BriskHeat Selected Again to Supply Out-of-Autoclave Composite Heating Solution

Columbus,OH –Â- BriskHeat Corporation's configurable heating system has been selected again by another major aerospace industry Original Equipment Manufacturer for an out-of-autoclave composite curing solution. This is the second customer to choose BriskHeat for composite curing in the past three months. BriskHeat's out-of-autoclave heating system is capable of providing precise and...

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Epoxy Adhesive suits microelectronic assembly applications.
Epoxies

Epoxy Adhesive suits microelectronic assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing,Â- non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip...

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Conductive Adhesive suits die attach applications.
Adhesives

Conductive Adhesive suits die attach applications.

Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity...

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Do You Have Unique Lifting Needs?
Sponsored

Do You Have Unique Lifting Needs?

EZRig Cranes offers lifting solutions that are engineered for robust performance, providing the ultimate in portability. Designed for real-world lifting needs, our products are small and light with options and features that make them ideal for a broad range of applications. See our video to learn how an EZRig Crane can simplify your lifting requirements.

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