Sealants

Lead Paint Sealant/Treatment is formulated for safety, efficacy.

AppliedÂ- via paint sprayer, brush, or roller, Lead Defender® is formulated with lead treatment reagents made with food-grade additives for natural binding properties. Blend provides human bioavailability reduction in case of accidental ingestion of treated lead paint dust/chips. Adhesion reduces prep time and supports application on diverse surface types. Integrated technology seals...

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Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA
Sealing Equipment

Nordson DIMA's Hot Bar Assembly Processes to be Exhibited at IPC APEX 2016, Las Vegas, USA

Demonstrations to show range of applications for hot bar soldering and heat seal bonding processes used during electronics manufacturing See Nordson DIMA at IPC APEX Booth 1841 Deurne, The NetherlandsÂ- – Nordson DIMA, a division of Nordson (NASDAQ: NDSN), will demonstrate its hot bar soldering and heat seal bonding equipment at IPC APEX EXPO 2016, in the booth of sister company, Nordson...

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Adhesives

ETFE Adhesive chemically bonds to engineered plastics.

Able to bond to dissimilar materials, such as polyamides, polyethylenes, and metals, Fluon® ETFE LH-8000 is suited for producing multilayer structures in one-step process without surface treatment. Chemical-resistant product has ultra-low melting point of 180–190°C, and offers wide processing temperature range between melting point and onset of degradation (350°C). Typical...

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Dymax SpeedMask® Masking Resins to be Showcased at MRO Americas
Adhesives

Dymax SpeedMask® Masking Resins to be Showcased at MRO Americas

Torrington, Connecticut – Dymax Corporation will showcase SpeedMask® line of masking resins in Booth #4211 at MRO Americas, scheduled to take place April 5-7, 2016 at the Kay Bailey Hutchison Convention Center in Dallas, Texas.Â-  SpeedMask products replace tapes, waxes, lacquers and fixtures while offering reliable protection against most metal-finishing process environments....

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Epoxies

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which...

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Silicone-Free Tapes target aerospace composite industry.
Adhesive Tapes

Silicone-Free Tapes target aerospace composite industry.

Suited for low out-gassing applications requiring EMS 595, High Temperature Silicon-Free Adhesive Tapes include DW915-1 and DW915-2 polyester tapes for composite Lay-up; DW716-2HD PTFE tape for use as composite tool coat; DW379 printable glass tape for aerospace blanket seaming; and DW417 consisting of flexible dead soft foil supplied on release liner, suitable as heat shield tape. All are...

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Paints

Anti-Slip Paints withstand tough industrial applications.

By providing textured coating, Good Grip® Anti-Slip Paints eliminate dangerous, slick surfaces almost anywhere in just one coat. Epoxy resin formula adheres to wood, fiberglass, cement, and most materials. Paints dry tack-free in 60 minutes, are fully cured in 24 hours, and are resistant to oil, gas, and most chemicals. Meeting OSHA recommended static coefficient of friction, paints are...

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Adhesive Tapes

Material Highlight: 3M 442F

This month's material highlight features 3M's 442F double-coated adhesive tapes. The 442F features a thin polyester film carrier that provides dimensional stability and improved handling with ease of die-cutting and laminating. 442F comes standard with 3M Adhesive 830. The 830 is a firm rubber adhesive system that provides a combination of good adhesion, good temperature performance, good...

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Conductive Adhesive has low-temperature cure capability.
Adhesives

Conductive Adhesive has low-temperature cure capability.

Designed for circuit assembly applications, EMS 618-116 cures in 30 min at 100°C or faster at elevated temperatures and forms high-strength, high-reliability conductive interconnects. This conductive adhesive, as low-temperature cure, single-part system, specifically suits static drain and EMI/RFI shielding applications.

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We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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