Fast Cure Adhesives suit cartridge dispensing.
Suitable for use with TriggerBondÃ-® dispensing guns, TriggerBond EpoxiesÃ- offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger....
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UV-Cured Epoxy Adhesive increases electronic assembly reliability.
Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip...
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Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion
Master Bond EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. This system is notable for...
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Silver-Filled Epoxy Adhesive suits applications up to 480-
Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-Ã-
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Material Selection Guide: High & Low Density Polyethylene
In this eBook, learn about high-density and low-density polyethylene's similarities, differences, and practical applications from New Process Fibre.
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Epoxy Adhesive suits microelectronic assembly applications.
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90Ã-
Read More »Multi-Purpose Repair Epoxy offers syringe-style packaging.
To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed,Ã- epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties,...
Read More »Low-Viscosity Epoxy Adhesives offer fast set times.
Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of...
Read More »Valtech Corporation Displays Full Line of Consumable Products Used in the PV Industry
POTTSTOWN, Pa. - Valtech Corporation, a leading global manufacturer of various consumable products used in the photovoltaic industry will be displaying their full line of high-performance epoxy adhesives, custom molded polymers, and formulated cleaning detergents at Intersolar North America, July 12-14, 2011, Moscone Center, San Francisco (Booth 9115). Valtech's epoxy adhesive systems exceed the...
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Wearing Compound protects against impact and abrasion.
DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.Ã-² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45Ã-
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Epoxy Potting Compound suits applications up to 365-
Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight,...
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Ensure Your Medical Device Meets Regulatory Standards with Triad's Custom Magnetics
Triad Magnetics' custom components for medical devices are designed and manufactured with the strictest regulatory standards in mind. Our capabilities include rapid design, prototyping, and testing of inductors, transformers, and power supplies for medical equipment. Check out our video to learn more.
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