Flexible, Thixotropic, One Component Dual Cure Epoxy
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. The system's adaptability to varying depths...
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Toughened, One Component Epoxy Features High Glass Transition Temperature
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (Tg) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing. Supreme...
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Electrically Insulative Two Component Epoxy Features High Elongation
Master Bond EP21LVFL combines good flexibility with a solid strength profile. It is curable at room temperature with a long working life of 120-160 minutes at 75°F for a 100-gram batch and features a flowable initial mixed viscosity of 10,000-14,000 cps. This epoxy generates low exotherm making it suitable not only for bonding and coating but also for sealing and potting applications. EP21LVFL...
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Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two-part, room-temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications. This toughened epoxy delivers an elongation of 60-70%. It has good strength properties with a tensile lap...
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Makers Nutrition: Choosing the Optimal Supplement Manufacturer
This white paper provides and overview into choosing the optimal supplement manufacturer. Establishing your nutraceuticals company is a multi-faceted project.
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One Part, Toughened Epoxy for Dam-And-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure...
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Thixotropic Epoxy Features Low Coefficient of Thermal Expansion
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional...
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Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature...
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Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization
Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization...
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Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a...
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Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it...
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SEALTITE® Fittings and Cord Grips Offer Longer Lasting Protection
Anamet Electrical's 316 Stainless steel SEALTITE® fittings and UL-listed cord grips protect sensitive wiring components from fluids, corrosive contaminations, bumps, and abrasions with a steel core and liquid tight conduit jacket. Check out this video to learn more.
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