One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...
Read More »
Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...
Read More »
6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...
Read More »
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...
Read More »
How to Effectively and Efficiently Clean Heat Exchangers, Part I
An introduction to a three part series about the importance, benefits, and methods of cleaning heat exchangers.
Read More »
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...
Read More »
Slideshow Offers More of 2017
Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...
Read More »
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500
Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100...
Read More »
One Part Epoxy has Low CTE
Adhesive EP13LTE Passes NASA Low Outgassing Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn’t require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional...
Read More »
Adhesives for Your Specific Needs
EP45HTAN: Thermally Conductive, Electrically Insulative Epoxy Well suited for metal bonding especially roughened titanium, EP45HTAN is a two part epoxy paste with superior strength retention at elevated temperatures. It bonds well to a wide variety of similar/dissimilar substrates, such as multiple metals, glass, composites and many plastics. This system combines cryogenic serviceability with...
Read More »
Master Bond EP3HTSDA-1 for Die Attach Applications
Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing. Watch Video on EP3HTSDA-1: http://click.skem1.com/click/koc3k-cbupji-13mg5467/ Updated Electronic...
Read More »
Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.
Read More »
