Epoxies

New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F
Epoxies

New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F

Master Bond’s EP17HTND-CCM Single Component Epoxy features a resistivity of more than 10^15 ohm-cm at 75°F and over 10^12 ohm-cm at 400°F. The compound can be used in -80°F to +600°F temperature and forms high strength bonds to substrates such as metals, ceramics, plastics, composites and circuit board materials. The material is offered in syringes with sizes ranging from 10 cc to 30 cc and...

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International Corporation Releases the E10-101 for Electric Bonding and Sealing Applications
Epoxies

International Corporation Releases the E10-101 for Electric Bonding and Sealing Applications

The E10-101 is a two part pure silver filled electrically conductive epoxy that has sealing applications that use fine electrical and mechanical properties. The product features a continuity of conductivity and a wide temperature range. The E10-101 has applications for in microwave EMI & RFI shielding, repairing of printed circuit boards, and as a cold solder for high sensitive components.

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New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments
Epoxies

New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments

Master Bond’s new EP42S-6 is UL 1203 certified for explosion proof and dust ignition proof electrical equipment. The epoxy can be used in Class I Division 1 Groups A, B, C, and D, as well as Class II Division 1 Groups E, F, and G. The two component epoxy is serviceable from -80 to 500 degrees F, and has dielectric strength of 440 volts/mil at 75 degrees F for .125 inch thickness. The epoxy also...

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New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Epoxies

New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi

Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...

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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Epoxies

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Epoxies

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Epoxies

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

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