Epoxies

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional...

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Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature...

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Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization...

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Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability

Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a...

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Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity

Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it...

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Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications

Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for...

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Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards

Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards

Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be...

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UL Certified Epoxy Encapsulant Resists Arcing without Igniting

UL Certified Epoxy Encapsulant Resists Arcing without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and...

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Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...

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CFI's New Flexible Coating Bridges Cracks in Concrete, Helps Seal Floors from Leaking

CFI's New Flexible Coating Bridges Cracks in Concrete, Helps Seal Floors from Leaking

Souderton, Pa. -- Coatings for Industry, Inc. (CFI) has introduced its new WearCOAT 474 Flexible Epoxy Coating, a two-part system designed to bridge small cracks in concrete slabs. It also functions as a waterproofing membrane to seal floors and help prevent leaks below the substrate. Combining flexibility and durability, WearCOAT 474 is capable of 85 percent elongation, about 30 times greater...

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