Epoxies

New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Epoxies

New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi

Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...

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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Epoxies

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Epoxies

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Epoxies

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Epoxies

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...

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Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Epoxies

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

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6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Epoxies

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...

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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Epoxies

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...

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Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Epoxies

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...

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Slideshow Offers More of 2017's New Adhesive Systems
Epoxies

Slideshow Offers More of 2017's New Adhesive Systems

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...

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