WINDGO, Inc. Granted Substrate-Backed Smart Damping Adhesive Patent
COLUMBIA, Mo., Oct. 4, 2018 /PRNewswire/ -- Today, WINDGO Inc., a research and development company specializing in smart material and vibrational transfer technologies announced that they have been granted US Patent No.10,088,011 for a substrate-backed Smart Damping Adhesive (SDA). This is in line with WINDGO's emphasis on energy, resonance and vibration technologies and products. WINDGO,...
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New Epoxy Adhesive Offers Volume Resistivity Between 0.005 and 0.0002 Ohm-cm
GPC-251/CA-414, the new room temperature curing, two-component electrically conductive epoxy adhesive from Creative Materials is suitable for making electrical and mechanical attachments on electrical components and devices. The product has a tensile strength 11,200 psi and thermal conductivity of 6.74 W/mK.
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DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks
Second Generation Materials Address Key Industry Needs; Build on Existing Portfolio WILMINGTON, DEL. (PRWEB) SEPTEMBER 12, 2018 - DuPont Electronics & Imaging today announced that it is launching its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric. IME technology enables...
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New DUO Eyelash Adhesives are Free from Formaldehyde and Latex
Qosmedix’s DUO® QUICK-SET™ Striplash Adhesives collection includes Dark (Part # 513710), White/Clear and a DUO® 2-in-1 Brush-On adhesive. The DUO® 2-in-1 brush-on adhesive features dual end with both dark and white/clear options. The product simplifies the eyelash application and is used by professional makeup artists.
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New 70-3812NC Epoxy Adhesive Meets NASA Outgassing Stamdards as per ASTM E-595-07
The 70-3812NC Aluminum Filled Epoxy Adhesive is designed for bonding heat sinks, which require high thermal conductivity and strong structural bonds. The product is cured at room temperature with mild heat and the 10:1 mix ratio used for batch mixing. The 70-3812NC adhesive is suitable for heat sink bonding applications such as fin to base, folded-fin set to base, pin-fin set to base and cold...
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Two-Component Potting Compound from DELO Protects Sensors
DELO-DUOPOX CR8031 safeguards electronic components from damage caused by chemicals Technical Specifications Good adhesion to different plastics, including polyamide and ABS Compression shear strength of 20 MPa on polyethylene Withstand temperatures up to 180°C Mechanical properties remain the same at 85°C and 85% air humidity Sudbury, MA November 2017 – DELO, one of the world’s leading...
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New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi
Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in...
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New FLEXBON OC512 PU Adhesive is Suitable on Solvent-Less Laminating Machines
FLEXBON OC512 PU Adhesive is used in laminating film with printed and un-printed board or paper with an average coating weight of 3 to 5 GSM. The product is pumped through a dispenser by heating at 80-100°C temperature.
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New HI-THANE Ink Binders and Adhesives are Suitable in Flexible Packaging Industry
Songwon offers HI-THANE™ A-9135T and A-9107T ink binders and HI-THANE™ A-7332 adhesive. The ink binders exhibit improved anti-blocking properties and high heat resistance. A-9135T and A-9107T are suitable for applications such as retort pouches, gravure and flexographic printing inks. A-7332 Solvent-free polyurethane laminating adhesive features enhanced wetting properties that reduces...
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New Electrically Conductive Adhesives Increase Module Performance
Henkel’s LOCTITE® ABLESTIK® ICP 8000 series Electrically Conductive Adhesives are designed for accommodating assembly processes such as shingled solar modules and cell interconnect ribbon bonding. The products offer compatibility with wafer thickness of less than 160 µm and printing and dispensing speeds of more than 200 mm per second. The adhesives increase in-line inspection and can cures...
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