MacDermid Alpha Presents, at PCIM Europe, Sharing The Latest Sintering Innovations for Power Electronics Packaging and Assembly, with Expert Guidance on Options for Challenging Applications Beyond Die Attach.

(Waterbury, CT USA) – 1 May 2023 – MacDermid Alpha Electronic Solutions, a leader in integrated technologies and materials for the electronics industry, will present and showcase their advanced solutions for die, package, and die top-side attach at PCIM Europe, held at the Nuremberg Exhibition Grounds, 9 - 11 May 2023. MacDermid Alpha’s expertise and product portfolio will be on display in...

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Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Thixotropic Epoxy Features Low Coefficient of Thermal Expansion

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional...

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Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements

Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature...

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Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and...

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New Light-Curable Materials Formulated with Low-Sensitizing Ingredients

New Light-Curable Materials Formulated with Low-Sensitizing Ingredients

Features high viscosity and reliability performance essential to the quality and clarity of an image or the integrity of devices. Designed for electronic wearables such as fitness trackers, smart watches, earbuds and VR headsets. Suitable for applications such as structural bonding, sensor encapsulation, lens alignment and selective coating.

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Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization

Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization...

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Dymax to Exhibit at MD&M West 2023 Trade Show

Dymax to Exhibit at MD&M West 2023 Trade Show

Torrington, Connecticut – January 24, 2023... Dymax, leading manufacturer of rapid and light-curing materials and equipment, a leading manufacturer of rapid and light-curing materials and equipment, will exhibit at MD&M West booth 1929, from February 6-8, 2023, at the Anaheim Convention Center in Anaheim, CA. For medical device design engineers, the first-of-kind 2000-MW series of medical...

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Delivery Equipment That Really Delivers
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Delivery Equipment That Really Delivers

Are you in need of safer, more efficient transportation equipment? Do you feel like your delivery equipment could really use an upgrade? Check out this video, and learn about Halo Ramp Company's patented safety platforms, and how they help you bypass your trickiest delivery challenges.

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