Epoxy features built-in cure indicator.

CHIPSHIELD 1455HD low-viscosity UV curable epoxy is designed to perform as chip coating both in smart cards and as a protective glob on PC surface-mounted chips. It is cured with long wave UV, 325-380 nm wavelength. Epoxy is light powder blue before cure, and faint rose to amber after cure, indicating cure has been completed. With Tg of 80Â-

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Acrylic Capstock Resin provides weatherability to HIPS.

SolarkoteÂ-® H Acrylic Capstock imparts weatherability to high-impact polystyrene (HIPS) sheets via co-extrusion. It provides protection from ultraviolet light for HIPS substrates without sacrificing impact performance of composite sheet. Co-extruded Solarkote H acrylic cap layers are inherently colorless. Cap layer screens out UV while maintaining high visible light transmission.

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Epoxy Adhesive cures at low temperatures.

Epoxy Adhesive cures at low temperatures.

TRA-BOND 400-5 thixotropic one-part epoxy system is used as a no-sag, non-drip staking and laminating adhesive. It combines properties of moderate working life with ability to cure at temperatures as low as 60Â-

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Epoxy provides clear lamination.

Epoxy provides clear lamination.

TRA-BOND 2119 low-viscosity epoxy is designed for bonding to glass, plastics and ceramics. It is a high Tg, high lap shear material with room temperature cure. Semi-rigid upon cure, it is suitable for bonding between dissimilar substrates. Applications include small potting, laminating and bonding of optics and electronics.

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