New Materials Products

Pre-Sintered Preforms feature low porosity.

Suited for high-temperature brazing applications, Pre-Sintered Preforms feature less than 2% porosity, which helps eliminate shrinkage. Curved, tapered, and cylindrical shapes are available with thicknesses from 0.010-0.200 in. Curved PSPs eliminate second braze cycle on convex and concave surfaces, while cylindrical PSPs will not sag or overflow during brazing. Intended for dimensional...

VME System offers rapid development and evaluation.

Easy PowerPC 750FX is a true turnkey VME system incorporating VME 2eSST-enabled PowerPC 750FX SBC with 256 Mb DRAM, 64 Mb Flash, 2 PMC sites, 36 Gb SCSI disk, 2U rack, embedded software, and 1 month access to technical support hotline. Suited for full range of mission-critical COTS applications, system is equipped with VxWorks 5.5, LynxOS, and Linux 2.4. Small demo and benchmark programs are...

Adhesive Film suits assembly of diagnostic devices.

BioflexÃ-® Rx630P consists of 7 mil clear polyester film coated on one side with 2.75 mil thermoplastic urethane heat-seal adhesive. Film is supplied on 1.5 mil polyester release liner. Capable of reactivation, thermoplastic adhesive has no tack and can be used on parts that will be stacked during assembly. High-tack, low-ooze product adheres to variety of substrates and is suited for...

Mold Polish eliminates unpleasant odors.

DiaMold(TM) High Intensity Polish restores surface finish and leaves high luster sheen. Non-hazardous, non-flammable, and non-corrosive polish cleans and removes haze from diamond-finished molds, dies, or fixtures without causing spiral webs, cattails, or other fine surface scratches. It also removes plate-out, oxidation, and stains on fine tooling surfaces quickly, leaving protective film that...

How to Choose the Right Adhesive Tape for Your Application

With a considerable number of adhesive materials, applications and methods, there are many options to consider when choosing an adhesive tape. As NADCO® is a leading manufacturer of custom tapes and labels; we took our years of experience to create this handy selection guide on choosing the right adhesive tape for your application.

Interconnect Flux is water-soluble.

Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.

Adapter Card enables communication with serial I/O.

Isolated adapter card, PCI-AC48, links RS-485 serial devices with industrial and personal computers using 33 MHz PCI bus. It enables RS-485 communication with Opto 22 serial-based I/O, including remote bricks for mistic(TM) I/O product family, as well as SNAP-B3000 serial brain. Product incorporates 2 RS-485 serial ports that provide communication in 2- or 4-wire mode, and software that allows...

Epoxy Mold Compound suits SIP applications.

HysolÃ-® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Ã-

Double-Coated Film suits medical device assembly.

Type TM9720 consists of 0.5 mil clear polyester film carrier, semi-bleached kraft release liner, and hypoallergenic medical-grade adhesive. Product is suited for medical devices where skin contact is possible such as surgical drapes, diagnostic sensors, and dental dams.

PVDF Sheet Material suits semiconductor applications.

Polyvinylidene fluoride (PVDF), high-purity sheet material meets requirements of Factory Mutual (FM) Clean Room Materials Flammability Test Protocol, Class 4910. FM 4910, manufactured from KynarÃ-® 740 resin, features double-masked surface, fully traceable and verifiable resin, chemical-resistance, and UV-stability. It measures 4 x 8 ft with thicknesses from 1/8-1 in. Sheet features tolerance...

Solder Wire is comprised of high-purity materials.

Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.

Innovative Dampney Coating Systems Suit Even the Most Specialized Applications

Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.