Materials

Mirror Covers help prevent service accidents.

Mirror Covers help prevent service accidents.

Mirror Mitts(TM) are bright yellow foam pads that slip on over fender spot mirrors and include the phrase Safety Is No Accident on front and back to reinforce safety in workplace. Measuring 18 x 16 in., Mirror Mitts are octagonal and consist of 2 flame-retardant, moisture-resistant foam pads joined by VelcroÂ-® one-wrap straps to facilitate mounting. They are suited for trucks, buses, RVs,...

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Drainage Composites contribute to LEEDS program credits.

Drainage Composites contribute to LEEDS program credits.

Available with filter fabric on one side and featuring square waffle configuration, Enkadrain 3000R subsurface drainage composites have polypropylene core made from 99.5% recycled post industrial waste. Because they exceed 40% post-industrial recycled content, they help contribute up to 2 LEEDS program points when used in conjunction with other recycled content products.

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Thermal Interface Material requires no heating.

Reworkable LoctiteÂ-® PowerstrateXtreme(TM), suited for use between heat sink and heat dissipating components, is supplied as free-standing film between 2 release liners. Compound flows at phase change temperature and conforms to surface features of heat sink and component. Upon flow, air is expelled from interface, thermal impedance is reduced, and product performs as thermal transfer...

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Pot Core Inductors feature high inductance.

Pot Core Inductors feature high inductance.

POWER POTS(TM) Series RL-7300 has 23 standard values for each of 5 different sizes. Units offer inductances from 10 mH to 1 H and handle currents from 12 mA to 1 A. Pot core design is capable of handling dc currents while maintaining stable inductance due to high saturation currents and self-shielding. Typical applications include dc chokes, differential mode chokes, filters, switching circuits,...

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Molding Compound suits harsh under-the-hood applications.

HysolÂ-® GR725-AG non-antimony/non-bromine/non-phosphorous semiconductor molding compound is suited for automotive applications. It replaces epoxy molding compounds containing brominated flame retardants and antimony trioxide, which can degrade gold wire/aluminum pad interconnects at elevated temperatures. Compound incorporates transition metal oxides and is suitable for use in Power SO...

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