Press Release Summary:
HysolÂ® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Â°C reflow temperature.
Original Press Release:
Semiconductor Epoxy Mold Compound for SIP on Laminate Now Commercially Available from Henkel Technologies
On the heels of several innovative product introductions, Henkel Technologies announces yet another exciting new advanced semiconductor packaging material. This latest product from Henkel Technologies, Hysol® GR9810, is a technologically advanced epoxy molding compound designed for System in Package (SIP) on Laminate applications.
Hysol® GR9810 epoxy molding compound is designed for use as an overmold on a wide variety of laminate-based molded array packages including SIP and flip-chip array packages that have been conventionally underfilled. The extremely flat nature of the product allows for the entire package to be processed in a non-warped state, which minimizes subsequent steps in the manufacturing process and can result in higher end-of-the-line yields.
Unique product characteristics of Hysol® GR9810 include ultra low warpage, the ability to underfill small ICs and passive components and superior adhesion to various laminate substrates. Further, Hysol® GR9810 is a green (non-antimony/non-bromine/non-phosphorous) molding compound and is capable of achieving JEDEC Level 2 requirements (substrate dependent) at 260°C reflow temperature.
For more information on Hysol® GR9810, call 1-716-372-6300 or send an e-mail to firstname.lastname@example.org.
P: 626-968-6511, x 414
"Henkel - A Brand like a Friend". With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. The business sector Henkel Technologies is one of the leading suppliers of adhesives, sealants and surface treatments for industrial customers. Strong brands, such as Loctite, Teroson, P3, Hysol and Liofol, are key drivers behind the success of the business sector. Henkel Technologies serves the automotive, electronics, aerospace, metal industries, assembly, maintenance and repair, consumer goods and packaging industries.
The Henkel Group operates in three strategic business areas - Home Care, Personal Care, and Adhesives, Sealants and Surface Treatment. In fiscal 2003 the Henkel Group generated sales of 9.436 billion Euro and an operating profit (EBIT) of 706 million euros. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel.