Solder

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Solder

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.

Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...

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Paste

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...

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Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017
Solder

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif. Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides...

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Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain
Solder

Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes: Are designed to provide ultra-low voiding Offer great print capabilities for small and low profile components Are designed to overcome head-in-pillow (HIP) Have excellent shelf and...

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Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016
Solder

Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key...

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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
Sponsored

Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.

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