New Solder Products

FCT Assembly to Exhibit at Local SMTA Rocky Mountain Expo

GREELEY, CO- – FCT Assembly today announced plans to exhibit at the SMTA Rocky Mountain Expo Tech Forum, scheduled to take place Wednesday, Jan. 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Solder experts will be available to discuss FCT’s NanoSlic-® Gold stencil and line of solution driven solder pastes. The NanoSlic-® Gold stencil is the next generation of stencil...

EVS to Debut the New Green EVS 500LF at the IPC APEX EXPO

EVS International, the leader in solder recovery, will debut the new EVS 500LF lead-free version in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. With the new EVS 500LF, EVS has managed to drastically reduce the size, weight, complication and footprint, while creating a greener lead-free system. EVS has continually...

The Balver Zinn Group to Exhibit Bi Rework Solder Paste at APEX

The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal. The new RoHS compliant paste reduces...

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste. The reliability of SN100C...

A Reference Guide To Frequency Conversion Power Supplies For Industrial Applications

The purpose of this guide is to assist contractors and purchasing agents charged with writing specifications for, and/or procuring, frequency converters.

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX

Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete...

Solder Pastes help reduce potential for tombstoning.

Offered as option with solder paste fluxes, anti-tombstoning solder pastes are suited for use when it is difficult to change reflow profile. Modification of alloy to introduce- melting range results in equalization of wetting forces. Because of this, small components are prevented from tombstoning. Optimal wetting characteristics apply to all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn,...

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150-

Non-Conductive Paste promotes flip chip application reliability.

Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability- for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200-

Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste

OSAKA, JAPAN- – Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego...

Reflow Soldering System offers void-free results. .

Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...

TPA Motion Introduces Industry's First Compact Robotic Positioner for Medical Devices

TPA Motion's microplate handling robots are designed specifically for medical instruments and lab automation devices. Check out the video to learn more.