Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
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Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019
Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...
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New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
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New Solder Cup from Mill Max Delivers Flexible Array of Solutions for Wire Termination Requirements
Suitable for spacing, height and orientation requirements. Features include discrete receptacles, terminal pins, spring-loaded pins, standard .100” pitch headers, sockets and spring-loaded connectors. Configurations are .050” and 2 mm pitch headers with straight and right-angle solder tail options, .050” pitch sockets, .050” pitch spring-loaded connectors and .100” pitch low profile...
Read More »Expanding Access: How to Get At-Home Medical Tests to Market and Patients
This e-book discusses how to get at-home medical tests to market and patients.
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New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
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New NT100Ge Lead-free Alloy Comprised Primarily of Tin, with Additions of Nickel, Copper and Germanium
Provides expanded access to cost-effective wave solder products. Delivers an identical alloy composition and excellent wave soldering performance. Advantages include formation of aesthetically appealing solder joint with a bright, smooth appearance, compatibility with wave and selective soldering machine metals.
Read More »
AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
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AMETEK's Cost-effective Copper Core Connect an Alternative to Thick Solder Preforms Often Used in Electronic Packaging
Designed for use in place of thick solder preforms often made of expensive material. Can be placed during a 2-D assembly process step using high melting point solder, allowing subsequent connections at higher elevations. Configurations are available in Solder/Cu/Solder and Solder/Cu/Al(Au) for both soldering and wire or ribbon bonding.
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New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
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New Solder Paste LOCTITE GC 18 is Designed for Multiple Component Sizes and Types
Available in Type 3 and Type 4 pastes and are halogen- and lead-free. Designed for thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Can be stored for one year at 26.5°C temperature and one month at 40°C.
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Neagle Choice, LLC Announces New Available Services
Neagle Choice has long been known as a quality source for commercial sewing, printing, die cutting, and the manufacturing of a wide range of custom products. Enhancing our service capabilities has been the key to our success, and has driven our growth into many new and exciting markets. Continuing on this trajectory, we now offer precision laser cutting and etching, adding to our long line of manufacturing services. See our video to learn all about it.
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