New Solder Products

Indium Corporation Features NC-SMQ®75 Die-attach Solder Paste at Productronica China

Indium Corporation will feature NC-SMQ-®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China. NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or...

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the APEX Hand Soldering Competition

The Balver Zinn Group announces that Cobar Solder Products Inc. is sponsoring the fourth annual IPC APEX EXPO-® Hand Soldering Competition, scheduled to take place Feb. 26, 2015 at the San Diego Convention Center in San Diego, CA. Cobar Solder Products is contributing Balver Zinn’s BRILLIANT B2012 SAC305 (SN97C) solder wire is halide-free, rosin-based and designed for manual and robotic...

Nihon Superior Announces Successful Product Launches at NEPCON Japan

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C...

FCT Assembly to Exhibit at Local SMTA Rocky Mountain Expo

GREELEY, CO- – FCT Assembly today announced plans to exhibit at the SMTA Rocky Mountain Expo Tech Forum, scheduled to take place Wednesday, Jan. 28, 2015 at the West Club at Mile High Stadium in Denver, CO. Solder experts will be available to discuss FCT’s NanoSlic-® Gold stencil and line of solution driven solder pastes. The NanoSlic-® Gold stencil is the next generation of stencil...

How Manufacturing Automation Can Reduce Workplace Injuries and Improve Morale

To learn more about how automation can solve your workplace issues, download the full white paper.

EVS to Debut the New Green EVS 500LF at the IPC APEX EXPO

EVS International, the leader in solder recovery, will debut the new EVS 500LF lead-free version in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. With the new EVS 500LF, EVS has managed to drastically reduce the size, weight, complication and footprint, while creating a greener lead-free system. EVS has continually...

The Balver Zinn Group to Exhibit Bi Rework Solder Paste at APEX

The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal. The new RoHS compliant paste reduces...

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste. The reliability of SN100C...

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX

Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete...

Pb-Free Solder Paste targets small, low-voltage QFN packages.

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150-

Non-Conductive Paste promotes flip chip application reliability.

Designed for flip chip packaging applications, 585-1 Non-Conductive Paste (NCP) promotes reliability- for gold stud bump interconnects. Ionically clean product, which cures in seconds during thermal compression bonding at 200-

Industry Leading OEM with over 65 Years of Experience

Blonder Tongue Laboratories provides ISO 9001:2015 certified electronic contract manufacturing services at our on-site lab. We specialize in video distribution, fiber optics, and communications but have a variety of services available to bring your products to market. See our video to learn more.