Solder

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.
Solder

Indium10.1HF Solder Paste meets IEC 61249-2-21 standards.

Offering low bridging, slump, and solder balling and low voiding in bottom termination component assemblies, Halogen-Free Indium10.1HF Solder Paste is formulated to maximize ECM and head-in-pillow performance. This paste minimizes solder beading and improves print transfer efficiency. Compatible with alloys like SnAgCu and SnAg, product provides improved wetting to common fresh and aged...

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Paste

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...

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Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017
Solder

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif. Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides...

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Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain
Solder

Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes: Are designed to provide ultra-low voiding Offer great print capabilities for small and low profile components Are designed to overcome head-in-pillow (HIP) Have excellent shelf and...

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Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions
Sponsored

Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions

Triad Magnetics is an established leader in power supply innovation, offering product lines that span a wide range of diverse industries and applications. Adding to their long list of successful product launches, Triad announces the release of the new cutting-edge JSU Series of power supplies. To learn about all of its advantages and advanced features, see our video.

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