New Solder Products

EVS to Debut the New Green EVS 500LF at the IPC APEX EXPO

EVS International, the leader in solder recovery, will debut the new EVS 500LF lead-free version in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. With the new EVS 500LF, EVS has managed to drastically reduce the size, weight, complication and footprint, while creating a greener lead-free system. EVS has continually...

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

OSAKA, JAPAN- – Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste. The reliability of SN100C...

The Balver Zinn Group to Exhibit Bi Rework Solder Paste at APEX

The Balver Zinn Group announces that Cobar Solder Products Inc. will highlight the Bi Rework Solder Paste (de-soldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The de-soldering paste has been designed for de-soldering Pb-free components and is ideal for LED removal. The new RoHS compliant paste reduces...

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at APEX

Indium Corporation will feature its new solder paste, Indium10.1, at IPC APEX Expo 2015 on Feb. 24 in San Diego, Calif. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes. The oxidation-inhibiting properties of Indium10.1 provide industry-leading head-in-pillow and graping resistance, with complete...

An Introduction to Purchasing Castings

To learn how Liberty Cast Products can guide you through your sand casting project, download now.

Reflow Soldering System offers void-free results. .

Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...

Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011

Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...

No-Clean Solder Paste has lead-free, synthetic formulation.

Made with 100% synthetic poly adduct components and suited for SMT assemblies, SynTECH-LF is compatible with tin/silver and tin/silver/copper alloys. Synthetic, non-organic formula optimizes lot-to-lot and stencil printing consistency and offers 12 hr stencil life and 12-16 hr tack time. Product leaves removable, non-conductive, non-corrosive, post reflow residue that acts as protective coating...

Lead-Free Solder Paste withstands extreme climate changes.

Suited for handheld and automotive sectors, Multicore LF620 ensures consistent print performance with minimal hot slump, even in regions with temperatures of 86-

Henkel to Show Latest Materials Innovations at APEX 2010

Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...

Cored Solder Wire is designed for Pb-free processes.

No-clean SR-37 LFM-22S cored solder wire is suited for manufacturers who do not require silver in Pb-free materials. By ensuring that, after soldering, small amount of flux remains on soldering iron tip, this solder material prevents further oxidation from taking place and allows iron to transfer heat to next joint. Result is accelerated wetting, consistent flux content, and tip-saving...

Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.