Adhesive reduces/eliminates stretch wrapping.

SKID-LOCKÂ-® Quickset-50 adhesive provides high shear strength and low tensile strength, making it suitable for palletizing loads. It prohibits stacked boxes from shifting during storage while permitting load to be broken when lifted straight up. Adhesive can be applied by brush, squeeze bottle, or pressurized extrusion/spray systems. It cleans easily and requires little or no maintenance.

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Epoxy bonds, seals and casts.

Flexible, 2-component EP21TPFL-1 polysulfide elastomer resists fuels, water, and aggressive chemicals. It cures at room temperature, is 100 percent reactive, and does not emit any volatiles during curing. Operating temperature range is -65 to +300 deg F. Thermal- and shock-resistant epoxy is available in 1/2 pint, pint, quart, gallon, and 5 gal kits, and in low and high viscosity versions.

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UV Coatings suit fiber-optic applications.

UV Coatings suit fiber-optic applications.

15C, 15D, and WCC2B one-part, UV fiber-coating materials are suitable for application to optical fiber. Adhesives can be supplied for miles or millimeters of cable. Adhesives protect cable behind fiber-optic devices and limit process time.

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Transfer Adhesive bonds electronic components.

ARcladÂ-® 9032 1-mil, electrically conductive, acrylic, pressure-sensitive transfer adhesive has durable polyester film release liner. Thin tape quickly builds strong bond, and is highly conductive in Z-axis. ARcladÂ-® 9032 is suitable for fabricating EMI shields, electrical interconnections, and ground plane assemblies. It is manufactured with plastic cores for compatibility with...

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Adhesive has high temperature resistance.

122-24 two-component, nitride filled, thermally conductive, low stress under fill adhesive is suitable for application by screen printing, dipping, and syringe dispensing. Product bonds silicon die to FR-4 boards in IC packaging applications. 122-24 provides outstanding adhesion to FR-4 boards as well as other substrates that have dissimilar coefficients of thermal expansion.

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Silicone Compound comes in syringe applicator.

Non-flammable, non-corrosive Silicone Compound is made of zinc filled polysiloxane. It enables low-loss thermal pathway for heat transfer between semiconductors and heat sinks by displacing air gaps between mating surfaces. Compound forms non-curing seal and maintains flexibile consistency within temperature range of -40 F to 500 deg F. It provides dielectric strength of 250-350 volts/mil and...

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Adhesives bond to difficult substrates.

Adhesives bond to difficult substrates.

TRA-BOND 293-1 general-purpose instrument adhesive provides strong, resilient bonds to gold, nickel, silver, copper, and brass substrates. It has Shore D hardness and high glass transition temperature. TRA-BOND 293-1T general-purpose adhesive is comparable to TRA-BOND 293-1, but is more thixotropic. TRA-BOND 293-1.5T general-purpose adhesive is also comparable to TRA-BOND 293-1, but is more...

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Splicing Tape offers quick tack and requires no clean up.

ARcladÂ-® 0068 double-faced repulpable splicing tape has aggressive adhesive for splicing hard-to-adhere-to paper and paperboard grades such as coated, uncoated, offset, tablet, rotogravure, kraft, toweling, linerboard, and specialty grade papers. It maintains tack over wide range of environmental conditions and is suitable for use with automatic core starters and slitters-rewinders.

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