Adhesive has high temperature resistance.
Press Release Summary:
122-24 two-component, nitride filled, thermally conductive, low stress under fill adhesive is suitable for application by screen printing, dipping, and syringe dispensing. Product bonds silicon die to FR-4 boards in IC packaging applications. 122-24 provides outstanding adhesion to FR-4 boards as well as other substrates that have dissimilar coefficients of thermal expansion.
Original Press Release:
Hi-Temperature Resistant, Thermally Conductive, Low Stress Under Fill Adhesive 122-24
DESCRIPTION:
CMI's 122-24 is a two component, high temperature resistant, nitride filled, thermally conductive, low stress under fill adhesive, suitable for application by screen printing, dipping and syringe dispensing. This product is specifically designed for bonding silicon die to FR-4 boards in IC packaging application. 122-24 is designed to provide outstanding adhesion to FR-4 board as well as a variety of other substrates. 122-24 is useful in bonding substrates that have dissimilar coefficients of thermal expansion.
APPLICATIONS:
Some applications for 122-24 include, but are not limited to:
* Bonding silicon die to FR-4 boards.
* Bonding of substrates that have dissimilar coefficients of thermal expansion.
STRENGTHS OF PRODUCT:
122-24 is versatile:
122-24 can be applied by using a variety of application techniques including syringe dispensing, dipping, and screen printing.
122-24 is useful:
122-24 is especially useful in applications, which need a high degree of thermal conductivity and temperature resistance.
