Epoxy Adhesive cures in 24 hours.

Press Release Summary:



Suitable for bonding and potting applications up to 250°F, HP 250 epoxy adhesive is resistant to heat, chemicals, and impact. With viscosity of 105,000 cps, HP 250 thixotropic paste will not sag or run when used on vertical or inverted surfaces. It cures at room temperature, and produces high-strength, durable, nonshrinking bonds. Working time is 65 minutes, tensile shear strength is 3200 psi, and peel strength is 35-40 pli.



Original Press Release:


HEAT-RESISTANT EPOXY IDEAL FOR BONDING OR POTTING


DANVERS, MA - Ideal for bonding and potting applications up to 2500 F, Devcon HP 250 high-performance epoxy adhesive is resistant to heat, chemicals, and impact.

With a viscosity of 105,000 cps, HP 250 is a thixotropic paste that offers excellent gap filling and will not sag or run when used on vertical or inverted surfaces. It cures at room temperature and produces high-strength, durable, nonshrinking bonds to a wide array of substrates, including metals, glass, ceramics, plastics, composites, concrete, and wood. It has a working time of 65 minutes and a functional cure time of 24 hours. Tensile shear strength (as tested on steel) is 3200 psi. Peel strength is 35-40 pli.

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