Epoxies

Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests
Epoxies

Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications. EP46HT-2AO Black combines superior thermal conductivity...

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Sherwin-Williams Announces Water & Wastewater Impact Award Winners
Coatings

Sherwin-Williams Announces Water & Wastewater Impact Award Winners

Short Elliott Hendrickson; Champion Coatings; Wapasha Construction; and the city of Austin, Minnesota, take top spot in inaugural program honoring project excellence using Sherwin-Williams Protective Marine Coatings CLEVELAND, OHIO – Short Elliott Hendrickson Inc. (SEH®), Champion Coatings, and Wapasha Construction took top honors in the inaugural Sherwin-Williams Impact Award program for...

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Rugged Epoxy Encapsulated Package Option for VPT Series
DC to DC Power Supplies (Converters)

Rugged Epoxy Encapsulated Package Option for VPT Series

BLACKSBURG, VA – VPT® Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI) today announced the availability of a fully encapsulated epoxy package option for its VPT Series of high-reliability DC-DC converters, EMI filters and accessory products. The epoxy packaging allows for aqueous cleaning processes often required in higher volume circuit board production applications. Additionally, the epoxy...

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Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Epoxies

Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...

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Epoxies

No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•Ã‚°F [1.30-1.44 W/(mÂ-·K) and a volume...

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Epoxy Adhesives target pipeline coatings.
Resins

Epoxy Adhesives target pipeline coatings.

Designed for repairing high pressure pipelines, KALFIX 911 and KALFIX 913 are pressure transfer fillers offering extreme adhesion, even to underwater surfaces. For pipeline coating or cold weather use, KALFIX 563 epoxy and curing agent is able to displace water for permanent bond to all substrates with minimal substrate preparation. KALFIX 206, combining liquid epoxy resin and high temperature...

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Epoxies

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...

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Epoxies

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has...

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Coatings

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which...

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Epoxy Potting Compound resists thermal shock and cycling.
Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.

PassingÂ- Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize...

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