EP3HTND-2Med Black Curing Epoxy meets USP Class VI standards.
Available in ½ pints, pints, quarts, gallons and 5 gallon containers, EP3HTND-2Med Black Curing Epoxy features 5,000-6,000 psi tensile strength. Having 1,600-1,800 psi tensile lap shear strength at room temperature, product bonds to glass, metals and ceramics. Used in -60°F to +400°F temperature, material provides resistance to sterilization methods such as chemical sterilants, EtO, radiation...
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Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving. As a one component system, EP3HTND-2Med Black does not require any mixing and...
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Thermally Conductive, High Temperature Resistant Epoxy Passes NASA Low Outgassing Tests
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments. This two component system blends thermal stability with a high strength profile for a variety of bonding, sealing and encapsulation applications. EP46HT-2AO Black combines superior thermal conductivity...
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Sherwin-Williams Announces Water & Wastewater Impact Award Winners
Short Elliott Hendrickson; Champion Coatings; Wapasha Construction; and the city of Austin, Minnesota, take top spot in inaugural program honoring project excellence using Sherwin-Williams Protective Marine Coatings CLEVELAND, OHIO – Short Elliott Hendrickson Inc. (SEH®), Champion Coatings, and Wapasha Construction took top honors in the inaugural Sherwin-Williams Impact Award program for...
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Microcontrollers in Power Electronics
This white paper explores the power supply advantages of digital microcontrollers, as well as how digital power supplies can be used to manage entire systems.
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Rugged Epoxy Encapsulated Package Option for VPT Series
BLACKSBURG, VA – VPT® Inc., a HEICO company (NYSE:HEI.A) (NYSE:HEI) today announced the availability of a fully encapsulated epoxy package option for its VPT Series of high-reliability DC-DC converters, EMI filters and accessory products. The epoxy packaging allows for aqueous cleaning processes often required in higher volume circuit board production applications. Additionally, the epoxy...
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Two Part, Nickel Conductive Epoxy Meets NASA Low Outgassing Specifications
Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications. It is a toughened system and is capable of withstanding rigorous thermal cycling, mechanical vibration and shock. This system passes ASTM E595 tests for NASA low outgassing, making it well...
Read More »No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications
Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•Ã‚°F [1.30-1.44 W/(mÂ-·K) and a volume...
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Epoxy Adhesives target pipeline coatings.
Designed for repairing high pressure pipelines, KALFIX 911 and KALFIX 913 are pressure transfer fillers offering extreme adhesion, even to underwater surfaces. For pipeline coating or cold weather use, KALFIX 563 epoxy and curing agent is able to displace water for permanent bond to all substrates with minimal substrate preparation. KALFIX 206, combining liquid epoxy resin and high temperature...
Read More »Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...
Read More »One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has...
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The Carbontec System: A Smarter Way to Heat Your Buildings
Carbontec's paper-thin radiant heating systems reduce energy consumption costs by warming the building surfaces instead of controlling air temperature. Check out our video to learn more.
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