Press Release Summary:
Thermally conductive, 2-part EP21TDCAOHT bonds dissimilar substrates with different coefficients of expansion and contraction. Adhering to metals, ceramics, glass, rubbers, and plastics, product has 1:1 mix ratio by weight or volume and cures at room temperature or more rapidly at elevated temperatures. Exhibiting thermal and mechanical shock resistance, it has paste viscosity, 35 pli T-peel strength, and service operating temperature range of -100 to +350Â°F.
Original Press Release:
New Thermally Conductive, Electrically Insulative Epoxy Adhesive
Master Bond inc., Hackensack, NJ. has introduced a new two component, flexibilized, thermally conductive epoxy adhesive called EP21TDCAOHT. This formulation cures at room temperature or more rapidly at elevated temperatures. It has a convenient mix ratio of 1 to 1, weight or volume. EP21TDCAOHT has high peel and shear strength and offers superior durability. It has outstanding thermal and mechanical shock resistance and is readily thermally cyclable. It's service operating temperature range is -100°F to 350°F.
EP21TDCAOHT has a paste viscosity and spreads evenly and smoothly. It is ideal for bonding dissimilar substrates with different coefficients of expansion and contraction. Adhesion to metals, ceramics, glass, rubbers and most plastics is excellent. EP21TDCAOHT has a volume resistivity of >1015 ohm cm and a thermal conductivity of 9-10 BTU/in/ft²/hr/°F. Additionally it has a T-peel strength of 35 pli.
Master Bond EP21TDCHAOHT is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits.
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