New Epoxies Products

Epoxy Adhesive/Sealant/Coating is chemical-resistant.

Featuring thermal stability, 2-component EP21ARHT-1 is 100% reactive and does not contain any solvents or diluents. It has 2:1 mix ratio by weight and cures at room temperature. Exhibiting minimal shrinkage upon cure, product does not sag or drip on vertical surfaces. Designed to withstand thermal shock and abrasion, it adheres to metals, glass, ceramics, cements, woods, vulcanized rubbers, and...

Epoxy Adhesive suits cryogenic applications.

Two-component, EP51FL epoxy resin system features 1:1 mix ratio, cures rapidly at room temperature, and has setup time of 30-40 min. Product is 100% reactive and emits no solvents or volatiles during cure. It bonds to metals, glass, ceramics, wood, various rubbers, and most plastics. Cured compound exhibits peel strength of more than 25 pli along with elongation of greater than 125%. Offering...

Epoxy adheres to glass, polycarbonates, and acrylics.

Suited for bonding, sealing, coating, encapsulation, and casting, EP30P transparent, 2-component epoxy system cures at room temperature, which can be accelerated by use of heat. Electrically insulating, 100% reactive system contains no solvents or diluents and exhibits minimal linear shrinkage upon cure. With tensile strength that exceeds 9,500 psi, product has mixed viscosity of 1,200-1,400 cps...

Epoxy provides high thermal conductivity.

Type EP34AN room temperature cure, 2-component epoxy adhesive/sealant, with thermal conductivity of 22-24 BTU/in/ftÃ-²/hr/Ã-

Stainless Steel Baskets For Medical and Pharmaceutical Applications

This white paper provides an in-depth overview into stainless steel baskets for medical and pharmaceutical applications.

Room Temperature Curing Epoxy withstands sterilization.

Dual-component EP42HT-2 epoxy adhesive, sealant, coating, and casting material withstands repeated sterilizations, including radiation, ethylene oxide, chemical sterilants, and steam. Featuring service operating temperature range of -60 to +450Ã-

Epoxy Mold Compound suits SIP applications.

HysolÃ-® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Ã-

Epoxy Adhesive/Encapsulant is flame retardant.

Self-extinguishing, 5 MinuteÃ-® Epoxy FR fills gaps and bonds rigid substrates such as metals, glass, ceramics, concrete, and wood. Mixed as dispensed, product has 115,000 cps viscosity, 3-5 min working time, 10-15 min fixture time, and 2-3 hr functional cure time. Once cured, it offers tensile shear strength of 2,800 psi on cold-rolled steel and dielectric strength of 490 V/mil. Bonds...

Epoxy Adhesive/Sealant resists temperatures up to 600-

One-component, heat-curing, EP17 offers service operating range of -300 to +600Ã-

Epoxy Syntactics feature rapid setting times.

Formulated in light blue, black, orange, and gray, Epocast 1633 epoxy syntactic materials are self-extinguishing and halogen-free. They have 2-5 min work life, are extrudable, and permit insert handling in less than 1 hr at room temperature. After gelling at 77Ã-

Repair Epoxy provides 450-

Bond-It(TM) 7056AL is filled with activated, aluminum metal creating fast-set, machinable, repair epoxy. With 1:1 mixing ratio, product is dispensed, mixed, and troweled on without running, dripping, or sagging. It cures at room temperature without objectionable or sulphur odors and hardens in 4-8 min. Bond-It 7056AL adheres to smooth, rough, or porous surfaces, including most plastics, metals,...

SpillVak Absorbs Up to 6X More Fluid Than Rock- and Clay-based Absorbents

Are you struggling to find an absorbent that doesn't result in at least some leaching? SpillVak outperforms all rock and clay-based materials. Check out our video to learn more.