Epoxies

Epoxy Mold Compound suits SIP applications.

HysolÂ-® GR9810 is used as overmold on laminate-based molded array packages including SIP and flip-chip packages. Flat nature of product allows entire package to be processed in non-warped state. Non-antimony, non-bromine, non-phosphorous compound can also underfill small ICs and passive components. It is capable of achieving JEDEC Level 2 requirements at 260Â-

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Epoxy Adhesive/Encapsulant is flame retardant.

Epoxy Adhesive/Encapsulant is flame retardant.

Self-extinguishing, 5 MinuteÂ-® Epoxy FR fills gaps and bonds rigid substrates such as metals, glass, ceramics, concrete, and wood. Mixed as dispensed, product has 115,000 cps viscosity, 3-5 min working time, 10-15 min fixture time, and 2-3 hr functional cure time. Once cured, it offers tensile shear strength of 2,800 psi on cold-rolled steel and dielectric strength of 490 V/mil. Bonds...

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Epoxy Syntactics feature rapid setting times.

Formulated in light blue, black, orange, and gray, Epocast 1633 epoxy syntactic materials are self-extinguishing and halogen-free. They have 2-5 min work life, are extrudable, and permit insert handling in less than 1 hr at room temperature. After gelling at 77Â-

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Repair Epoxy provides 450-

Repair Epoxy provides 450-

Bond-It(TM) 7056AL is filled with activated, aluminum metal creating fast-set, machinable, repair epoxy. With 1:1 mixing ratio, product is dispensed, mixed, and troweled on without running, dripping, or sagging. It cures at room temperature without objectionable or sulphur odors and hardens in 4-8 min. Bond-It 7056AL adheres to smooth, rough, or porous surfaces, including most plastics, metals,...

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Potting/Encapsulation Compound resists thermal shock.

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155Â-

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Epoxy Adhesive bonds large sandwich panels.

Epoxy Adhesive bonds large sandwich panels.

High-Strength AralditeÂ-® AW 8545-1 Resin/Hardener HW 8545-1 epoxy adhesive material bonds metal or composite skins to aluminum or aramid-fiber honeycomb cores. Low coefficient of thermal expansion minimizes read-through from internal honeycomb cores to panel surfaces. Adhesive has 1:1 mix ratio and readily spreadable viscosity of 43,000 cP. Once cured, adhesive produces durable laminates...

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