Epoxies

Coatings

Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which...

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Epoxy Potting Compound resists thermal shock and cycling.
Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.

PassingÂ- Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize...

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Epoxies

One-Component Epoxy Adhesive meets NASA outgassing specifications.

Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TCÂ- contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•Ã‚°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse...

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Toughened, Room Temperature Curing Epoxy Offers A Long Working Life
Epoxies

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical strength profile. Supreme 11HTLP is formulated to have impressive toughness, which imparts high bond strength of over 3,200 psi and 20 pli, respectively...

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One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
Epoxies

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications

Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of shadowing" issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat. Formulated for demanding...

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High Temperature Resistant, One Component Epoxy Cures at 200-220°F
Epoxies

High Temperature Resistant, One Component Epoxy Cures at 200-220°F

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other...

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Non-Drip Epoxy Paste cures optically clear.
Epoxies

Non-Drip Epoxy Paste cures optically clear.

Formulated to cure optically clear in thin sections, even though Part A is translucent and Part B is light amber, 2-component EP21NDCL is suited for bonding, sealing, and coating applications. Product has 1:1 mix ratio by weight or volume, which can be adjusted to deliver different properties. Curing at room temperature, paste provides high tensile lap shear, tensile, and compressive strength of...

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Epoxies

One-Component No Mix Epoxy features rapid cure properties.

Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45–50 min at 175°F or 25–30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and...

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High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements
Epoxies

High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a...

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Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.
Epoxies

Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.

With 90 min work life, SetWORX 90 toughened, 2-part epoxy adhesive bonds to such diverse substrates as metals, glass, ceramics, wood, and plastics. This Bishphenol A (BPA)-free system, offered in dual cartridges that let operator mix and dispense without weighing and mixing concerns, operates at elevated temperatures and maintains bond strength. Product comes in 50, 200, and 400 mL cartridges...

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3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership
Sponsored

3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership

At 3Sixty Mission Critical, we specialize in maintaining the performance and uptime of our customer's mission-critical applications. Our services are comprehensive and designed to take on the entire burden of maintenance. Our "UPS as a service" is just another example of how we develop out of the box solutions to help our customers operate more efficiently; see our video to earn more.

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