
New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F
Master Bond’s EP17HTND-CCM Single Component Epoxy features a resistivity of more than 10^15 ohm-cm at 75°F and over 10^12 ohm-cm at 400°F. The compound can be used in -80°F to +600°F temperature and forms high strength bonds to substrates such as metals, ceramics, plastics, composites and circuit board materials. The material is offered in syringes with sizes ranging from 10 cc to 30 cc and...
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International Corporation Releases the E10-101 for Electric Bonding and Sealing Applications
The E10-101 is a two part pure silver filled electrically conductive epoxy that has sealing applications that use fine electrical and mechanical properties. The product features a continuity of conductivity and a wide temperature range. The E10-101 has applications for in microwave EMI & RFI shielding, repairing of printed circuit boards, and as a cold solder for high sensitive components.
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New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments
Master Bond’s new EP42S-6 is UL 1203 certified for explosion proof and dust ignition proof electrical equipment. The epoxy can be used in Class I Division 1 Groups A, B, C, and D, as well as Class II Division 1 Groups E, F, and G. The two component epoxy is serviceable from -80 to 500 degrees F, and has dielectric strength of 440 volts/mil at 75 degrees F for .125 inch thickness. The epoxy also...
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New Epoxy Adhesive Offers Volume Resistivity Between 0.005 and 0.0002 Ohm-cm
GPC-251/CA-414, the new room temperature curing, two-component electrically conductive epoxy adhesive from Creative Materials is suitable for making electrical and mechanical attachments on electrical components and devices. The product has a tensile strength 11,200 psi and thermal conductivity of 6.74 W/mK.
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How to Select a Rubber Compounding & Mixing Supplier
To learn more about rubber compounding and mixing, and how experienced manufacturers like AirBoss can meet your needs, download this whitepaper now.
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New 10-3044 Epoxy Adhesive Can Bond to Aluminum and Steel
The new 10-3044 Epoxy Adhesive from Epoxies, Etc can bond to aluminum and steel and also to other substrates. It is tough and is resistant to chemicals. The 10-3044 cures within two hours at room temperature. It is compatible with cleaning solutions for stencils and screens.
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New 50-3112 Thermally Conductive Epoxy Develops Adhesive Strength Within Four Hours
The 50-3112 Thermally Conductive Epoxy is offered in TriggerBond® dual barrel cartridge system. It provides a lap shear strength of 1,400 psi and 2,200 psi after four and twenty-four hours respectively. The epoxy with a quick cure and easy application is suitable for manufacturers with thermal management issues. It is thermally conductive and electrically insulating.
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New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...
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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...
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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...
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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...
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Complete Water Solutions Offers Wide Range of Water Treatment Equipment
Complete Water Solutions provides full installation tailored to your water treatment needs. Check out the video to learn more.
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