New 10-3044 Epoxy Adhesive Can Bond to Aluminum and Steel
The new 10-3044 Epoxy Adhesive from Epoxies, Etc can bond to aluminum and steel and also to other substrates. It is tough and is resistant to chemicals. The 10-3044 cures within two hours at room temperature. It is compatible with cleaning solutions for stencils and screens.
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New 50-3112 Thermally Conductive Epoxy Develops Adhesive Strength Within Four Hours
The 50-3112 Thermally Conductive Epoxy is offered in TriggerBond® dual barrel cartridge system. It provides a lap shear strength of 1,400 psi and 2,200 psi after four and twenty-four hours respectively. The epoxy with a quick cure and easy application is suitable for manufacturers with thermal management issues. It is thermally conductive and electrically insulating.
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New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...
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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...
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Whitepaper: 7 Trends for IoT in Hospitality
Check out this white paper to see how the IoT can be used in your hotel to reduce energy consumption, increase guest satisfaction, improve maintenance, and more.
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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...
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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...
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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...
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Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...
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6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...
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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...
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Precision Machined Parts for High Tech Applications
For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.
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