New Epoxies Products

New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages

Irvine, California, August 8, 2006 New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices. Uniting the robust performance characteristics of die attach...

Adhesive is formulated for strength and flexibility.

Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and...

Adhesive is suited for bonding semiporous materials.

Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical,...

Epoxy Adhesive acts as electrical insulator.

Model EP21 2-component, room temperature curing, epoxy adhesive allows adjustment of properties by altering mix ratio. Adhesive holds up to thermal cycling and resists chemicals including water, oils, fuels, acids, bases, and salts. With gap filling properties and operating temperature of -60 to 250Ã-

Elastomer Shlastomer, Right? Selecting the Right Elastomer for Your Sealing Boots and Fasteners

Different elastomer formulations affect your parts' physical properties, functions, and service life. Therefore, it's important to test a few different elastomers, when assembling your product, to determine the best one for your needs.

Adhesive and Epoxy are designed for flip chip assembly.

Material GPC-251A/B is silver-filled, electrically conductive, 2-part, room-temperature curing adhesive used to connect bumps on underside of circuit boards. Product cures in 24 hr @ 25Ã-

Repair Epoxy forms machinable aluminum layer.

Packaged in pre-measured job sized kits, 450Ã-

Low Viscosity Adhesive offers Tg of 90-

TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.