New Epoxies Products

High-Temperature Epoxy bonds to wide range of substrates.

TRABOND 2248 thixotropic, all-liquid system applies at room temperature, but requires high-temperature cure. It bonds to metals, glass, ceramics, and plastics. Ultimate glass transition temperature is 109Ã-

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155Ã-

Epoxy Adhesive contains no volatiles or solvents.

Two-component EP24 cures at room temperature or more rapidly at elevated temperatures. It will also cure at colder temperatures, down to 20Ã-

Epoxy Adhesive bonds large sandwich panels.

High-Strength AralditeÃ-® AW 8545-1 Resin/Hardener HW 8545-1 epoxy adhesive material bonds metal or composite skins to aluminum or aramid-fiber honeycomb cores. Low coefficient of thermal expansion minimizes read-through from internal honeycomb cores to panel surfaces. Adhesive has 1:1 mix ratio and readily spreadable viscosity of 43,000 cP. Once cured, adhesive produces durable laminates...

A Guide to Quality Control of the SMT Process

The printed circuit board (PCB) manufacturing process begins with cutting-edge equipment capable of accurately picking and placing up to 40,000 components per hour. This innovative equipment keeps error rates extremely low, and those defects that do occur are quickly caught by sensitive laser and optical inspection equipment.

Adhesive resists exposure to repeated sterilization.

EP45HTMed 2-component, heat-cured epoxy adhesive withstands long-term exposure from -80 to +500Ã-

Metal-Filled Epoxies repair industrial machinery.

Plastic SteelÃ-® Putty (A) bonds to metals, concrete, and plastics, forming repairs that can be drilled, tapped, machined, or painted. It resists oil, gasoline, water, and chemicals at service temperatures to 250Ã-

Epoxy Adhesive has thixotropic index of 4.1.

Moisture-resistant TRA-BOND 789-3T3N1 is suited for side mount staking of components and any application were resistance to wicking and flow is critical. Product exhibits electrical resistance and has viscosity of over 200,000 cps. Thermal expansion coefficient ensures bonding to substrates, and product works on hard-to-bond substrates such as nickel, gold, and copper.

Emergency Repair Putty provides waterproof seals.

Effective at temperatures to 250Ã-

Epoxy Adhesive creates electrically insulating contacts.

Tra-Bond 816H02 is suitable for stacking transistors, diodes, resistors, and integrated circuits to PCBs. Rheology of adhesive allows it to stay in place once dispensed. It bonds readily to metals, silica, steatite, sapphire, ceramics, glass, and plastics. It can be cured at room temperature to Shore D Hardness of 90 and has working life of 1.5 hr.

Epoxy Adhesive bonds to similar and dissimilar substrates.

Two-component, nickel-filled, electrically-conductive adhesive, Type EP76M features volume resistivity of 5-10 ohm-cm and thermal conductivity of 8-9 BTU/in./ftÃ-²/hr/Ã-

Simple Connection � MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.