Epoxies

Kalpoxy NS Wear Compound

Kalpoxy NS Wear Compound

Abresist Kalenborn Corporation offers KALPOXY NS, a non-sagging epoxy bonded wear compound suitable for repairing almost any surface, including piping and pumps. This two component wear compound contains more than 70% fine grain silicon carbide (SiC) particles combined with DuPont KevlarÂ-® fibers for excellent abrasion resistance, toughness and adhesive properties. KALPOXY NS is easy to use...

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Nu Flow Develops New High-Temp Chemical Resistant Epoxy

Nu Flow has developed a new high temperature, high chemical resistant epoxy for pipe lining, five years after others claimed to have invented the lining process that Nu Flow had acquired from American Pipe Lining. American Pipe Lining, a technology partner with Nu Flow brought the small diameter epoxy pipe lining process to North America in 1980, decades before these companies had entered the...

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Vibration-Resistant Epoxy Compound bonds ceramic wear tiles.

Vibration-Resistant Epoxy Compound bonds ceramic wear tiles.

With tensile shear strength of 2,350 psi and flexural strength of 11,800 psi, Aremco-Bond(TM) 2150 is suited for bonding ceramic wear tiles used to line chutes, ducts, centrifuges, and other components that experience high abrasion and erosion. Ceramic-filled, black pigmented, 100% solids epoxy operates at up to 400Â-

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UV Cure Adhesive suits electronics assembly applications.

UV Cure Adhesive suits electronics assembly applications.

Non-conductive 535-10M-1 is flexible epoxy adhesive that suits disk drive, camera module, optoelectronic, and circuit assembly applications. Product is designed to eliminate any crowning (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in head stack assembly. Also, this antimony-free adhesive can be used for lens bonding in camera modules, chip...

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Electrically Conductive Silver Adhesive cures in 45 seconds.

Electrically Conductive Silver Adhesive cures in 45 seconds.

Used for cold soldering and bonding electrical and electronic components where soldering is impractical, Metaduct(TM) 1245 is 100% solid silver adhesive formulated as electrically conductive, 2-part epoxy that cures at room temperature. This solvent-free, non-bleeding, thixotropic, and non-flammable adhesive, able to replace leaded and lead-free hot solder, provides over 600 psi tensile shear...

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Epoxy Compound serves potting applications from -67 to 365-

Epoxy Compound serves potting applications from -67 to 365-

Available for electrical and electronic potting applications, thermally conductive Aremco-Bond(TM) 2318 is medium-viscosity (16,000 cP mixed), black-pigmented epoxy compound with 12,300 psi flexural strength and 1,135 psi tensile-shear strength. Other properties include volume resistivity of 3.0 x 1015, dielectric strength of 460 V/mil, and dielectric constant of 4.8 at 1 kHz. Recommended cure...

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Engineered Material Systems Debuts New 535-10M UV Cure Adhesive for Disk Drive Applications

DELAWARE, OH - Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces its 535-10M UV Cured Epoxy formulated for disk drive, camera module, optoelectronics and circuit assembly applications. This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M is a low outgassing, flexible,...

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Epoxy Potting Compound withstands temperatures up to 392-

Used to encapsulate small electrical components in medical device industry, EC-1014M-1 meets NASA outgassing standards and offers optimal performance in extreme environments of heat and caustic chemicals. Thermally conductive potting compound provides Shore D hardness of 90 when cured, which enables resistance to physical shock. In addition to pint, quart, gallon, and 5 gallon sizes, product is...

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Epoxy Adhesive withstands exposure to UV rays.

Epoxy Adhesive withstands exposure to UV rays.

Virtually invisible, type 10-3713, 2-component epoxy adhesive dries clear so excess material is barely noticeable. Formulated with agents that guard against UV rays, non-yellowing epoxy has low viscosity that allows for good coverage of all surfaces, and bonds to most substrates. It penetrates substrates to form bonds at room temperature or with mild heat.

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