Epoxies

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
Epoxies

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications

Master Bond UV15DC80Med offers a unique dual curing mechanism which employs UV light followed by heat to complete the polymerization. This allows for curing areas on parts that do not allow UV light curing because of shadowing" issues. This kind of UV system is highly desirable because it allows for rapid fixturing with completion of the cure accomplished by adding heat. Formulated for demanding...

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High Temperature Resistant, One Component Epoxy Cures at 200-220°F
Epoxies

High Temperature Resistant, One Component Epoxy Cures at 200-220°F

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220°F. Cures can be accelerated at higher temperatures. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates in the aerospace, electronic, optical and other...

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Non-Drip Epoxy Paste cures optically clear.
Epoxies

Non-Drip Epoxy Paste cures optically clear.

Formulated to cure optically clear in thin sections, even though Part A is translucent and Part B is light amber, 2-component EP21NDCL is suited for bonding, sealing, and coating applications. Product has 1:1 mix ratio by weight or volume, which can be adjusted to deliver different properties. Curing at room temperature, paste provides high tensile lap shear, tensile, and compressive strength of...

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Epoxies

One-Component No Mix Epoxy features rapid cure properties.

Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45–50 min at 175°F or 25–30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and...

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Distillation 101: A Guide to Distillation and Separation Technologies
Sponsored

Distillation 101: A Guide to Distillation and Separation Technologies

Distillation is a separation unit operation that involves multiple countercurrent-stage steps, separating two or more volatile components. This results in the contact of liquid and vapor most generally in counterflow. Distillation 101: A Guide to Distillation and Separation Technologies provides an in-depth look at everything you need to know about distillation, including: Design procedures Equipment components Applications

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High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements
Epoxies

High Temperature Resistant, Optically Clear, Two Part Epoxy Meets NASA Low Outgassing Requirements

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications. This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80 by weight. It features an exceptionally long open time of at least 2-3 days at room temperature in a...

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Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.
Epoxies

Structural Epoxy Adhesive/Sealant is BPA-free and non-hazardous.

With 90 min work life, SetWORX 90 toughened, 2-part epoxy adhesive bonds to such diverse substrates as metals, glass, ceramics, wood, and plastics. This Bishphenol A (BPA)-free system, offered in dual cartridges that let operator mix and dispense without weighing and mixing concerns, operates at elevated temperatures and maintains bond strength. Product comes in 50, 200, and 400 mL cartridges...

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Structural Bonding Epoxy has high-strength, one-part formula.
Epoxies

Structural Bonding Epoxy has high-strength, one-part formula.

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offersÂ- respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000–550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable...

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Epoxy Polysulfide System exhibits high thermal conductivity.
Epoxies

Epoxy Polysulfide System exhibits high thermal conductivity.

Along withÂ- 9-10 BTU•in/ft²•hr•Ã‚°F thermal conductivity, EP21TPFL-1AO electrically insulative, 2-part system exhibits chemical resistance and offers 150%–200% elongation, 70-90 Shore A hardness, and 2:3 mix ratio by weight or volume. Black and white color coding facilitates mixing, and working life is 90–120 min at 75°F. Curing fully at ambient...

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Coatings

Epoxy Coating suits applications above or below water.

Based on blend of liquid epoxy polymer and aliphatic polyamine curing agents, KALCOAT™ 560 can displace water from wet surfaces to make permanent bond. High build 100% solids epoxy coating is solvent-free and incorporates Kevlar® microfibers for reinforcement and viscosity management for high application rates. KALCOAT 560 can be used as anti-corrosive coating, repair compound, fairing...

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UV Cure Adhesive suits circuit assembly applications.
Encapsulants

UV Cure Adhesive suits circuit assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

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