Epoxies

Structural Bonding Epoxy has high-strength, one-part formula.
Epoxies

Structural Bonding Epoxy has high-strength, one-part formula.

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offersÂ- respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000–550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable...

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Epoxy Polysulfide System exhibits high thermal conductivity.
Epoxies

Epoxy Polysulfide System exhibits high thermal conductivity.

Along withÂ- 9-10 BTU•in/ft²•hr•Ã‚°F thermal conductivity, EP21TPFL-1AO electrically insulative, 2-part system exhibits chemical resistance and offers 150%–200% elongation, 70-90 Shore A hardness, and 2:3 mix ratio by weight or volume. Black and white color coding facilitates mixing, and working life is 90–120 min at 75°F. Curing fully at ambient...

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Coatings

Epoxy Coating suits applications above or below water.

Based on blend of liquid epoxy polymer and aliphatic polyamine curing agents, KALCOAT™ 560 can displace water from wet surfaces to make permanent bond. High build 100% solids epoxy coating is solvent-free and incorporates Kevlar® microfibers for reinforcement and viscosity management for high application rates. KALCOAT 560 can be used as anti-corrosive coating, repair compound, fairing...

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UV Cure Adhesive suits circuit assembly applications.
Encapsulants

UV Cure Adhesive suits circuit assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

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Two-Part Epoxy Paste has ultra low thermal resistance.
Coatings

Two-Part Epoxy Paste has ultra low thermal resistance.

Master Bond EP48TC has thermal resistance of 5–7 x 10–6 K•m2/W, which enables thermal conductivity of 20–25 BTU•in/ft2•hr•Ã‚°F. Applied in bond lines as thin as 10–15 microns, epoxy paste has tensile lap shear strength from 900–1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75°F is 90–120 min. Curing at...

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Epoxy Stick facilitates fuel tank repairs.
Putty

Epoxy Stick facilitates fuel tank repairs.

Offering resistance to ethanol and most solvents, Permatex Fuel Tank Repair Epoxy Stick is suited for filling holes and damaged seams in both metal gas tanks and containers. Product comes as 2-part putty in stick form which helps measure and mix proper amount. Finished repair sets in just 1 hour and can be drilled, sanded, threaded, or filed after 5 hours. When fully cured, epoxy withstands...

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Fast Cure Adhesives suit cartridge dispensing.
Epoxies

Fast Cure Adhesives suit cartridge dispensing.

Suitable for use with TriggerBond® dispensing guns, TriggerBond EpoxiesÂ- offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes...

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UV-Cured Epoxy Adhesive increases electronic assembly reliability.
Epoxies

UV-Cured Epoxy Adhesive increases electronic assembly reliability.

Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip...

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Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion
Coatings

Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion

Master Bond EP42HT-2LTE is often chosen for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. This system is notable for...

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NASA Low Outgassing Approved, One Component Epoxy Features a Glass Transition Temperature of 225°C
Epoxies

NASA Low Outgassing Approved, One Component Epoxy Features a Glass Transition Temperature of 225°C

Formulated to operate over the wide temperature range of -80°F to +650°F, Master Bond EP17HT-LO is a one part epoxy for bonding, sealing, coating and encapsulation applications. This low viscosity system has very low exotherm upon curing and can be cast in sections up to and beyond a Â-½ inch in thickness. As a single component system, it offers convenient handling, doesn’t...

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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
Sponsored

Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber

Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.

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