Epoxies

Preforms

Epoxy Film features high electrical conductivity.

Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is...

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Thermally Conductive Epoxy suits heat exchange applications.
Epoxies

Thermally Conductive Epoxy suits heat exchange applications.

Aremco-Bond(TM) 568 2-part, 1:1 mix, aluminum-filled epoxy system provides mechanical strength and thermal conductivity to 400°F, making it suitable for bonding aluminum and copper heaters and heat sinks. Thermal conductivity is 9.0 Btu-in./hr-ftÂ-²-°F, and flexural and tensile strength is 11,400 and 2,500 psi, respectively. Aremco-Bond(TM) 568 is resistant to wide range of...

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Epoxy Adhesive suits bicycle building applications.
Epoxies

Epoxy Adhesive suits bicycle building applications.

Gap filling, sag resistant Araldite 2015 epoxy securely joins dissimilar materials used in fabricating bike accessories. It attains handling strength after 4 hours at room temperature and produces joints with lap shear strength of 3,200 psi at room temperature. Epoxy dispenses, waste-free, from 50 ml, dual barrel cartridges and handles temperatures from -67 to 250°F. Adhesive produces...

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Adhesive/Sealent has temperature range of -300 to +300°F.
Epoxies

Adhesive/Sealent has temperature range of -300 to +300°F.

Master Bond Polymer System Supreme 10HTFL one component, flexible, epoxy resin based adhesive/sealant cures to flexible thermoset polymer at temperatures of 250-300°F and above and does not require refrigeration for extended storage before use. It adheres to metallic and non-metallic substrates and exhibits tensile lap shear strengths of more than 2,000 psi and T-peels in excess of 60 pli....

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CMAA Crane Buyer's Guide
Sponsored

CMAA Crane Buyer's Guide

CMAA has organized this Buyer's Guide to promote standardization and to assist prospective buyer's of electric overhead traveling cranes in selection of equipment most suitable for their applications.

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Prototyping Systems

Materials are offered in varying densities for design work.

Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÂ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ft³ density and 27 Shore D hardness. Suited for milling foundry...

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Water-Based Epoxy suits industrial/marine applications.
Coatings

Water-Based Epoxy suits industrial/marine applications.

Fast Clad(TM) DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4-6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77Â-ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water,...

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Epoxy Adhesive offers high flexibility.
Epoxies

Epoxy Adhesive offers high flexibility.

Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30-40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is...

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Epoxies

Activated Epoxy bonds dissimilar materials.

Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400°F service, product provides high temperature stability, and electrical, thermal, and chemical resistance.

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Epoxy encapsulates microelectronic chips.
Epoxies

Epoxy encapsulates microelectronic chips.

TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.

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Encapsulants

Sealant/Encapsulant cures with heat or UV light.

EMCAST 4100, 100% solids, single-component, epoxy-based adhesive can be cured by exposure to ultra violet light in 320-380 nm wavelength range and/or with heat above 110°C to cure shadowed areas. Medium-viscosity product cures to rigid material with Shore D hardness of 92, CTE of 25 ppm/°C, and 150°C Tg. It adheres to various metals and ceramic surfaces and does not need to be...

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