Epoxies

Epoxy encapsulates microelectronic chips.
Epoxies

Epoxy encapsulates microelectronic chips.

TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.

Read More »
Encapsulants

Sealant/Encapsulant cures with heat or UV light.

EMCAST 4100, 100% solids, single-component, epoxy-based adhesive can be cured by exposure to ultra violet light in 320-380 nm wavelength range and/or with heat above 110°C to cure shadowed areas. Medium-viscosity product cures to rigid material with Shore D hardness of 92, CTE of 25 ppm/°C, and 150°C Tg. It adheres to various metals and ceramic surfaces and does not need to be...

Read More »
Epoxies

Epoxy Putty is packaged in a one piece stick.

MinuteMend(TM) 2-part epoxy putty bonds to wet and dry surfaces, and once dry, can be tapped, sawed, drilled, machined, stained, or painted. Product mixes in the hand and hardens in minutes. It is USDA approved for use in meat and poultry plants, contains no solvents, and will not shrink. Putty permanently repairs scratches, gouges, and holes and stops leaks. Available in 2 and 4-oz sticks.

Read More »
Epoxies

Adhesive resists temperatures to 400°F.

Room temperature curing EP21HT, 2-component epoxy adhesive, has 1:1 mix ratio, weight or volume. It is 100% reactive and contains no solvents or volatiles. With service operating temperature range of -60 to +400°F, product bonds to similar and dissimilar substrates including metals, glass, ceramics, wood, rubbers, and plastics. Characteristics include volume resistivity of >1014 ohm-cm,...

Read More »
Epoxies

Epoxy Adhesives require no fixturing.

Available as in three formulations, adhesives withstand service temperatures of -40 to +200°F. General-purpose adhesive/encapsulant, 5 Minute® Epoxy, has mixed viscosity of 10,000 cps. With mixed viscosity of 150,000 cps, 5 Minute® Epoxy Gel is thixotropic, non-sagging gel with gap-filling properties. Thixotropic, non-sagging gel, One Minute(TM) Epoxy Gel, has 30,000 cps mixed...

Read More »
Adhesive offers high thermal conductivity.
Epoxies

Adhesive offers high thermal conductivity.

Two-component, room temperature curing EP21ANHT features thermal conductivity of over 22BTU/in/ftÂ-²/hr/°F. It comes in paste form and offers high bond strength to wide variety of substrates. Bonds resist water, oil, fuels, and many solvents. Shore D hardness is >85 and volume resistivity is >1013 ohm-cm. Cures can be accelerated by use of heat. EP21ANHT is recommended for high...

Read More »
Flexible Epoxy bonds to variety of surfaces.
Epoxies

Flexible Epoxy bonds to variety of surfaces.

TRA-BOND 872-3 transparent, flexible epoxy bonds materials with mismatched coefficients of thermal expansion. It readily bonds to metals, plastics, glass, and ceramics. When fully cured, epoxy is a translucent, electrically insulating material, with added resistance to moisture, gases, petroleum products and many other chemicals. Long work-life makes it suitable for applications involving...

Read More »
High Temperature Resistant Epoxy is chemical-resistant.
Epoxies

High Temperature Resistant Epoxy is chemical-resistant.

EP125 two component epoxy system, suited for service above 500°F, withstands exposure to boiling acids, alkalis, salts, fuels, and organic solvents. Able to bond to metallic and nonmetallic surfaces, product offers typical lap shear strengths of 2,400-2,500 psi at ambient temperatures. Castings exhibit flexural strength as high as 15,000 psi and flexural moduli of more than 500,000 psi....

Read More »
Epoxies

Epoxy forms bonds for continuous use to 400°F.

Stress-free Duralco(TM) 125N forms flexible, electrically conductive bonds with moisture, chemical, and solvent resistance. Able to cure at room temperature, product exhibits flexural strength of 1,150 psi, 70 Shore D hardness, and compressive strength of 6,000 psi. With density of 2.7-3.0 gm/cc, epoxy requires no measuring and does not put forth any odor. Product bonds to glass, ceramics,...

Read More »
Epoxy Compound cures at room temperature.
Encapsulants

Epoxy Compound cures at room temperature.

General-purpose casting compound LX30007, suited for underfill and encapsulating applications, produces strong bonds, with lap shears of over 2,000 psi. With glass transition temperature of 78°C, 2-part epoxy offers viscosity of 7,600 cps and cures at room temperature.

Read More »

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers