Epoxies

Prototyping Systems

Materials are offered in varying densities for design work.

Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÂ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ft³ density and 27 Shore D hardness. Suited for milling foundry...

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Water-Based Epoxy suits industrial/marine applications.
Coatings

Water-Based Epoxy suits industrial/marine applications.

Fast Clad(TM) DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4-6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77Â-ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water,...

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Epoxy Adhesive offers high flexibility.
Epoxies

Epoxy Adhesive offers high flexibility.

Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30-40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is...

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Epoxies

Activated Epoxy bonds dissimilar materials.

Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400°F service, product provides high temperature stability, and electrical, thermal, and chemical resistance.

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Epoxy encapsulates microelectronic chips.
Epoxies

Epoxy encapsulates microelectronic chips.

TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.

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Encapsulants

Sealant/Encapsulant cures with heat or UV light.

EMCAST 4100, 100% solids, single-component, epoxy-based adhesive can be cured by exposure to ultra violet light in 320-380 nm wavelength range and/or with heat above 110°C to cure shadowed areas. Medium-viscosity product cures to rigid material with Shore D hardness of 92, CTE of 25 ppm/°C, and 150°C Tg. It adheres to various metals and ceramic surfaces and does not need to be...

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Epoxies

Epoxy Putty is packaged in a one piece stick.

MinuteMend(TM) 2-part epoxy putty bonds to wet and dry surfaces, and once dry, can be tapped, sawed, drilled, machined, stained, or painted. Product mixes in the hand and hardens in minutes. It is USDA approved for use in meat and poultry plants, contains no solvents, and will not shrink. Putty permanently repairs scratches, gouges, and holes and stops leaks. Available in 2 and 4-oz sticks.

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Epoxies

Adhesive resists temperatures to 400°F.

Room temperature curing EP21HT, 2-component epoxy adhesive, has 1:1 mix ratio, weight or volume. It is 100% reactive and contains no solvents or volatiles. With service operating temperature range of -60 to +400°F, product bonds to similar and dissimilar substrates including metals, glass, ceramics, wood, rubbers, and plastics. Characteristics include volume resistivity of >1014 ohm-cm,...

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Epoxies

Epoxy Adhesives require no fixturing.

Available as in three formulations, adhesives withstand service temperatures of -40 to +200°F. General-purpose adhesive/encapsulant, 5 Minute® Epoxy, has mixed viscosity of 10,000 cps. With mixed viscosity of 150,000 cps, 5 Minute® Epoxy Gel is thixotropic, non-sagging gel with gap-filling properties. Thixotropic, non-sagging gel, One Minute(TM) Epoxy Gel, has 30,000 cps mixed...

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Adhesive offers high thermal conductivity.
Epoxies

Adhesive offers high thermal conductivity.

Two-component, room temperature curing EP21ANHT features thermal conductivity of over 22BTU/in/ftÂ-²/hr/°F. It comes in paste form and offers high bond strength to wide variety of substrates. Bonds resist water, oil, fuels, and many solvents. Shore D hardness is >85 and volume resistivity is >1013 ohm-cm. Cures can be accelerated by use of heat. EP21ANHT is recommended for high...

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