Epoxies

Epoxies offer unlimited working time.

Epoxies offer unlimited working time.

Single-component Series SC 2000 epoxies bond metal, ceramics, glass, and other substrates. Heat-cured, self-leveling adhesives require no mixing and offer unlimited working time at room temperature. Available in 4 formulations, products provide thermal stability, corrosion resistance, and gap-filling properties. SC 2001 and SC 2003 withstand service temperatures from -40Â-

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Adhesive is suitable for fiber connector applications.

Adhesive is suitable for fiber connector applications.

TRA-BOND 526M04 two-part, low-viscosity epoxy adhesive provides versatility of fast heat cure and stands up to 85/85 testing. Product is suited for critical, high-temperature, fiber-optic applications that require lowest stress possible, including polar maintaining fiber work.

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Epoxy is formulated for extended pot life.

OPTOCAST 3410 GEN 2 ultraviolet light and/or heat curable epoxy is suitable for opto-electronic assembly. It cures rapidly when exposed to UV light in 320-380 nm range with low shrinkage. Maximum ionic content is 10 ppm total Na+, K+, and Cl-. Epoxy is ideal for fixturing and aligning optical devices with less than 1 -µ movement throughout its service life. Working life at room temperature is...

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Aluminum-Filled Epoxy cures at room temperature.

Aluminum-Filled Epoxy cures at room temperature.

Type EP22 2-component epoxy adhesive features 1:1 mix ratio by weight or volume. It produces high strength bonds with adhesion to metals, particularly steel and aluminum. Bonds are resistant to thermal cycling and chemicals. Epoxy is readily machinable and can be employed over temperature range of -60 to 250Â-

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Epoxy bonds plastic products.

Epoxy bonds plastic products.

Two-part TRA-BOND 2170T is suitable for bonding nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton, and almost any thermoplastic substrate. It is thixotropic to allow for more control over flow. Epoxy can be used for automotive, medical, aerospace, photonic, and assembly applications.

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