Epoxies

Epoxy Adhesive/Sealant meets NASA low outgassing requirements.

Epoxy Adhesive/Sealant meets NASA low outgassing requirements.

Offering optical clarity and chemical resistance, UV10TKLO-2 is not oxygen inhibited and cures rapidly at room temperature when exposed to UV light. Maximum UV absorption takes place in 320-365 nm range. One component, modified epoxy system has volume resistivity of greater than 1014 W cm, dielectric constant of 3.6 at 60 Hz, and service temperature of -60 to 300Â-

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Potting Compound has flexible, low-viscosity formulation.

Potting Compound has flexible, low-viscosity formulation.

Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...

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Two-Component Epoxy Adhesive gels in 3 minutes.

Two-Component Epoxy Adhesive gels in 3 minutes.

Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250Â-

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Bondmaster Epoxy Adhesives for Motors Now Available in Cartridge Sizes

SAN DIEGO, May 9, 2007 - National Adhesives has announced, here at The Motor & Motion Association's (SMMA) Spring Management Conference, that it is offering several of its Bondmaster (www.bondmaster.com) structural epoxy adhesives for motor assembly in cartridge sizes. Key Bondmaster products now available in cartridge sizes include A 410-5P and A 359, which provide high strength and high impact...

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Adhesive Epoxy has operating range of -65 to 400-

Adhesive Epoxy has operating range of -65 to 400-

Designed for high performance bonding, sealing, and casting, Model EP21TDC-4HT epoxy compound resists vibration, impact, and shock, and can be room temperature or heat-cured. High physical strength properties include tensile strength of 8250 psi, tensile shear strength of more than 2800 psi, and peel strength exceeding 36 pli at 25Â-

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Epoxy System resists temperatures up to 400-

Epoxy System resists temperatures up to 400-

Medium-viscosity, 2-component EP30HT has 4:1 mix ratio by weight, is 100% reactive, and does not contain solvents or volatiles. It cures at room temperature or more rapidly at elevated temperatures. Serving as adhesive/sealant, coating, and casting compound, product adheres to metals, glass, ceramics, woods, vulcanized rubbers, and plastics. Optically clear formula has refractive index of 1.54...

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New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages

Irvine, California, August 8, 2006 New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices. Uniting the robust performance characteristics of die attach...

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Adhesive is formulated for strength and flexibility.

Adhesive is formulated for strength and flexibility.

Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and...

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Adhesive is suited for bonding semiporous materials.

Adhesive is suited for bonding semiporous materials.

Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical,...

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