Epoxies

Repair Compounds

Epoxy Compound passes NASA outgassing specifications.

Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.

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Epoxies

Flame Retardant Epoxy Adhesive suits staking applications.

Thermally conductive, electrically insulating Tra-Cast LX50019 is used for staking and setting transistors, diodes, resistors, integrated circuits, and other heat-sensitive components in printed circuit electronic applications. RoHS-compliant product develops high-impact bonds at room temperature, and has coefficient of thermal expansion that makes it compatible for bonding variety of substrates...

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Epoxies

Putty repairs and rebuilds worn metal.

Consisting of alumina-filled epoxy compound, Ceramic Repair Putty(TM) is engineered to form smooth barrier against abrasion, corrosion, cavitation, and chemical attack. Non-sagging product covers 66 sq-in./lb at thickness of Â-¼ in. Applied with trowel, putty fills voids, protecting equipment from further damage. Pot life is 25 min, and functional cure is attained in 16 hr at room...

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Epoxies

Adhesive/Sealant is 2-component, optically clear epoxy.

With 1:1 mix ratio by weight or volume, low-viscosity EP37-3FLF cures at room temperature and bonds to metal, glass, ceramic, rubber, and plastic substrates. Bonds offer resistance to impact, shock, and thermal cycling. Also usable as potting and encapsulation compound, product has service operating temperature range of -80 to +250°F, Shore D hardness of 30, and tensile strength of 4,000...

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Epoxies

Flexible Epoxy Adhesive dispenses with pinpoint accuracy.

Electrically conductive, 400°F Duralco 125 requires no measuring, mixing, or clean up of excess epoxy. User snaps on static mixing tube and squeezes to apply. Product cures at room temperature, with no objectionable odors, to provide thermal and mechanical shock strength, adhesion to dissimilar substrates, and chemical resistance. Applications include flexible circuits, solder replacement,...

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Epoxies

Epoxy Adhesive is NASA outgassing approved.

With working life of 60 min, black medium-viscosity TRA-CAST 3145 can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. Product is thermally conductive, electrically insulating, and suitable for staking transistors, diodes, resistors, ICs, and other heat-sensitive components in PCB applications. TRA-CAST 3145 has 100% reactive solids content, offers Shore D...

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Epoxies

Adhesive combines epoxy and light cure chemistries.

Loctite® 3355(TM) works on colored and opaque substrates such as metals, plastics, glass, and ceramics that cannot transmit light. Once dispensed onto opaque part, exposure to UV light at 254-365 nm for 5-60 sec activates adhesive, which cures to fixture strength in minutes and reaches full cure in hours at room temperature. Single component, medium viscosity product requires no mixing,...

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Epoxies

Epoxy Adhesive passes NASA outgassing tests.

With operating temperature of 4°K to 400°F, thermally conductive, electrically insulative EP21TCHT-1 cures at room temperature or more rapidly at elevated temperatures. It features mix ratio of 100:60 by weight and mixed viscosity of light paste. Product is 100% reactive and does not contain solvents or diluents. It adheres to metals, ceramics, glass, wood, vulcanized rubbers, and...

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Epoxies

Flexible Epoxy dispenses with pinpoint accuracy.

Supplied in hand-held applicator, 400°F Duralco 125 cures at room temperature to provide electrical conductivity, thermal and mechanical shock resistance, adhesion to dissimilar substrates, and chemical resistance. No mixing or measuring is required. Adhesive is suited for manufacture and repair of flexible circuits, solder replacement, bonding semiconductors, EMI shielding, bonding...

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Encapsulants

Epoxy Potting Compound has mixed viscosity of 6,700 cp.

Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75-80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130°C, and dielectric strength of 450 V/mil.

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