Epoxies

High-Strength Epoxy makes repairs in environments up to 400°F.
Epoxies

High-Strength Epoxy makes repairs in environments up to 400°F.

Used for repairing defects and corrosion pitting in aluminum molds and wear surfaces, Aremco-Bond(TM) 2210 aluminum- and ceramic-filled compound provides abrasion, corrosion, and impact resistance. Tensile shear strength is 2,600 psi, and flexural strength is 14,100 psi. Mixed in 100:14 ratio of resin to hardener by weight, 100% solids epoxy cures at room temperature in 24-48 hr and can be...

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Epoxy Adhesive/Sealant meets NASA low outgassing requirements.
Epoxies

Epoxy Adhesive/Sealant meets NASA low outgassing requirements.

Offering optical clarity and chemical resistance, UV10TKLO-2 is not oxygen inhibited and cures rapidly at room temperature when exposed to UV light. Maximum UV absorption takes place in 320-365 nm range. One component, modified epoxy system has volume resistivity of greater than 1014 W cm, dielectric constant of 3.6 at 60 Hz, and service temperature of -60 to 300°F. Product is suited for...

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UV Curable Compound with Superior Gap Filling Properties
Epoxies

UV Curable Compound with Superior Gap Filling Properties

HACKENSACK, NJ - Oct 29, 2009 - Master Bond UV10TK40 is a UV curable, no-mix epoxy resin system with exceptional sealing and gap-filling properties. It excels in applications such as aligning parts and bonding irregularly shaped surfaces, especially in production environments where increased speed and reduced waste are paramount. Its very high surface hardness (Shore A >75) also makes it an...

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Potting Compound features 6 hr working life.
Encapsulation Equipment

Potting Compound features 6 hr working life.

Qualified for filament winding applications, EP29LP-1 exhibits physical strength that enhances component resistance to thermal shock. It adheres to various substrates, including optical fibers and fibrous reinforcements, and has bond strength of greater than 3,500 psi. With peak exotherm as low as 50°C, this 2-part, optically clear epoxy is resistant to chemicals and offers compound flow,...

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Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxies

Epoxy Adhesive has linear shrinkage of 0.0003 in./in.

Low viscosity, optically clear, two part epoxy compound, EP30LV-1 is formulated to cure at room temperatures, and forms bonds with both similar and dissimilar materials including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Electrical insulator adhesive requires only contact pressure for curing. Suitable applications include optical, electronic, electrical, computer,...

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Epoxies

Epoxy Adhesive conducts static electricity through filters.

Magnobond® 133-351 A/B is 2-part epoxy adhesive that bonds fuel filter media to filter end caps. Its conductive carbon filler allow static electricity to be discharged safely, enabling filter manufacturers to use it to create static discharge circuit. Designed to bond dissimilar substrates, low-viscosity adhesive also offers chemical resistance.

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Epoxy Adhesive suits temperatures up to 600°F.
Epoxies

Epoxy Adhesive suits temperatures up to 600°F.

Designed to withstand severe and repeated thermal cycling, Master Bond EP46HT-1 has continuous service operating temperature range of -100 to +550°F and can withstand intermittent exposures up to 600°F. It has glass transition temperature of over 235°C and provides adhesion to metals, glass, vulcanized rubbers, and most plastics. Product cures rapidly at elevated temperatures,...

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Thermal Adhesive Film provides electrical insulation.
Miscellaneous Film

Thermal Adhesive Film provides electrical insulation.

Formulated to function as preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices, FL901AO epoxy film can cure in 1 hr at 250°F or 30-40 min at 300°F. B-stage, 100% solid adhesive-preform offers thermal conductivity of 10 BTUoin./ftÂ-²hr°F and volume resistivity exceeding 10 x 1012 W-cm, providing no-mess solution to...

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Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Miscellaneous Compounds

Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components

HACKENSACK, NJ - Sept 10, 2009 - Master Bond EP30M3LV is a specially engineered, low exothermic epoxy system formulated to help avoid excess heat buildup and damage to thermally sensitive components during potting operations. It also contains a special additive to remove air bubbles. This compound cures at room temperatures or more rapidly at elevated temperatures. It can be cured in various...

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