Epoxies

Water-Debondable Epoxy facilitates solar silicon wafer slicing.
Epoxies

Water-Debondable Epoxy facilitates solar silicon wafer slicing.

Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, Loctite® 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, Loctite®...

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Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization
Epoxies

Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization

HACKENSACK, NJ - Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2MED (Black) fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants. EP42HT-2ND2MED (Black) is an excellent electrical insulator...

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Polymers

Valtech Corporation Displays Full Line of Consumable Products Used in the PV Industry

POTTSTOWN, Pa. - Valtech Corporation, a leading global manufacturer of various consumable products used in the photovoltaic industry will be displaying their full line of high-performance epoxy adhesives, custom molded polymers, and formulated cleaning detergents at Intersolar North America, July 12-14, 2011, Moscone Center, San Francisco (Booth 9115). Valtech's epoxy adhesive systems exceed the...

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Wearing Compound protects against impact and abrasion.
Epoxies

Wearing Compound protects against impact and abrasion.

DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.Â-² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45° angle. With working time of 25 min, non-sagging compound can be applied by trowel...

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Epoxy Potting Compound suits applications up to 365°F.
Encapsulation Equipment

Epoxy Potting Compound suits applications up to 365°F.

Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight,...

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Low Thermal Expansion Epoxy passes NASA low outgassing tests.
Epoxies

Low Thermal Expansion Epoxy passes NASA low outgassing tests.

Formulated with blend of polymeric and inorganic materials, 100% reactive EP30LTE-LO is used for bonding, sealing, casting, and coating applications. This 2-component epoxy exhibits dimensional stability and is serviceable over -60 to +250°F range. CTE is 12x10-6 in./in./°C, and shrinkage rate is less than 0.0002 in./in. Producing bonds with tensile strength over 5,000 psi,...

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Flexible Epoxy withstands cryogenic conditions.
Encapsulation Equipment

Flexible Epoxy withstands cryogenic conditions.

Serviceable over wide range of 4 K to 250°F, Polymer System EP37-3FLF cures at room temperature in 2-3 days or faster at elevated temperatures. Optically clear, 2-component epoxy offers non-critical 1:1 mix ratio and low mixed viscosity of 1,400-1,500 cps. With bond shear strength exceeding 2,000 psi and T-peel strength of 25 pli, flexible epoxy bonds to metals, glass, ceramics, rubber, and...

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Chemically Resistant Epoxy withstands one year in sulfuric acid.
Coatings

Chemically Resistant Epoxy withstands one year in sulfuric acid.

Used for coating, lining, bonding, or sealing, EP21AR withstand acidic environments - including immersion in 96-98% sulfuric acid and 36% hydrochloric acid for over one year. This 2-component epoxy, with dielectric strength of 400 V/mil, also acts as electrical insulator and is serviceable from -60 to +275°F. It produces abrasion-resistant bonds with tensile strength over 10,000 psi, shear...

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Thermal Epoxy Adhesive serves thermal management applications.
Epoxies

Thermal Epoxy Adhesive serves thermal management applications.

Formulated for use in manufacture of computer components and LEDs, 109-12 Thermally Conductive Low-Stress Epoxy is resistant to thermal-cycling and exhibits minimal shrinkage during cure. Thermal adhesive, used to interface between heat-producing component and heat-sink in electronics designs, has viscosities of 500,000 cps at room temperature or 60,000 at 50°C. This reduces air entrapment,...

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Silver Conductive Epoxy Meets NASA Low Outgassing Standards
Epoxies

Silver Conductive Epoxy Meets NASA Low Outgassing Standards

HACKENSACK, NJ - Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200Â-ºF, producing tough high...

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