Epoxies

Anisotropic Conductive Adhesives suit LCD manufacturing.
Epoxies

Anisotropic Conductive Adhesives suit LCD manufacturing.

Available as paste, film, or pressure-sensitive tape, Anisotropic Conductive Adhesives are conductive in Z-axis and non-conductive in X- and Y-axis. During curing process, particles in adhesive become stacked in vertical configuration, providing conductivity for component that is mounted to surface, while remaining electrically insulating on X and Y axes. Applications include RFID manufacture,...

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Epoxy Adhesives meet military specifications.
Epoxies

Epoxy Adhesives meet military specifications.

Designed to meet extensive certification requirements of Test Method 5011 in MIL-STD 883, EPO-TEK®H20E- MP and EPO-TEK® EK1000-MP deliver optimal thermal management and electrical conductivity. Single component, silver-filled EPO-TEK EK1000-MP is formulated with shiny finish to maximize device reflectivity. Both products are suited for solar modules and concentrators, LEDs, and high...

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Epoxy Patch Compound is for emergency repairs to processing equipment.
Miscellaneous Compounds

Epoxy Patch Compound is for emergency repairs to processing equipment.

With 4 min working time and ability to achieve functional cure in 30 min, DFense Blok(TM) Quick Patch is formulated for emergency repairs to processing equipment, even in severe conditions, and suited for patching of holes, leaks, and cracks. Alumina ceramic bead-filled epoxy compound protects against wear, abrasion, and corrosion and helps extend equipment service life. Non-sagging product can...

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Epoxies

G5: Now for Cracked, Uncracked, & Seismic Conditions

Addison, IL - Epcon G5 adhesive, manufactured by ITW Red Head has received an updated evaluation report (ESR# 1137) from ICC Evaluation Service, Inc. (ICC-ES). This report now certifies the use of G5 in cracked, uncracked and/or all seismic conditions. Building officials, architects, contractors, specifiers, and others utilize evaluation reports to provide a basis for using or approving G5 in...

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Water-Debondable Epoxy facilitates solar silicon wafer slicing.
Epoxies

Water-Debondable Epoxy facilitates solar silicon wafer slicing.

Providing optimal bond strength to both silicon and glass and metal mounting substrates used during ingot sawing process, Loctite® 3382(TM) protects against wafer breakage. Two-part epoxy adhesive breaks down on exposure to hot water, eliminating corrosive debonding solutions and minimizing silicon waste that occurs during wafer cleaning process. Homogenous and stable, Loctite®...

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Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization
Epoxies

Medical Grade Epoxy Adhesive Withstands High Temperatures and Repeated Sterilization

HACKENSACK, NJ - Capable of tolerating the harsh environments of the medical industry, Master Bond EP42HT-2ND2MED (Black) fully complies with the testing requirements of USP Class VI plastics. This two component epoxy resists recurrent autoclaving and sterilizations including radiation, steam, ethylene oxide, and chemical sterilants. EP42HT-2ND2MED (Black) is an excellent electrical insulator...

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Polymers

Valtech Corporation Displays Full Line of Consumable Products Used in the PV Industry

POTTSTOWN, Pa. - Valtech Corporation, a leading global manufacturer of various consumable products used in the photovoltaic industry will be displaying their full line of high-performance epoxy adhesives, custom molded polymers, and formulated cleaning detergents at Intersolar North America, July 12-14, 2011, Moscone Center, San Francisco (Booth 9115). Valtech's epoxy adhesive systems exceed the...

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Wearing Compound protects against impact and abrasion.
Epoxies

Wearing Compound protects against impact and abrasion.

DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.Â-² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45° angle. With working time of 25 min, non-sagging compound can be applied by trowel...

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Epoxy Potting Compound suits applications up to 365°F.
Encapsulation Equipment

Epoxy Potting Compound suits applications up to 365°F.

Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight,...

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Low Thermal Expansion Epoxy passes NASA low outgassing tests.
Epoxies

Low Thermal Expansion Epoxy passes NASA low outgassing tests.

Formulated with blend of polymeric and inorganic materials, 100% reactive EP30LTE-LO is used for bonding, sealing, casting, and coating applications. This 2-component epoxy exhibits dimensional stability and is serviceable over -60 to +250°F range. CTE is 12x10-6 in./in./°C, and shrinkage rate is less than 0.0002 in./in. Producing bonds with tensile strength over 5,000 psi,...

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COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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