Epoxies

Floors

Flooring/Wall Products target restaurant industry professionals.

Used for floor and wall resurfacing, restoration, and protection, HardCore system creates durable floors and walls over new or damaged concrete and other substrates. System includes application of 5 products in various combinations: HardShield water-based, clear epoxy sealer; HardFlor heavy-duty, Â-¼ in. bonded industrial flooring surfaces; HardCote customizable coating for walls; HardCure...

Read More »
Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications
Coatings

Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications

Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures. With a Shore D hardness...

Read More »
Silver-Filled Epoxy Adhesive suits applications up to 480°F.
Epoxies

Silver-Filled Epoxy Adhesive suits applications up to 480°F.

Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product...

Read More »
Epoxy Adhesive suits microelectronic assembly applications.
Epoxies

Epoxy Adhesive suits microelectronic assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing,Â- non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip...

Read More »
Gels

Dimensionally Stable Two Component Urethane Modified Epoxy Gel Is Thermally Conductive

Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is aÂ-  soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for bonding and sealing as it adheres well to a variety of substrates including metals, glass, ceramics and many rubbers and plastics. With a low...

Read More »
Epoxies

Non-Sag, Thermally Conductive Epoxy Adhesive

With thick paste consistency, Epoxyset's EB-403-1LV-T1 bonds to diverse substrates including metals, composites, glass, ceramics, rubbers, plastics and will not run or sag even when applied to vertical surfaces even at elevated temperatures. Bonds resist thermal cycling, autoclave, as well as chemicals, including water, oils, fuels, acids, bases, and salts. This one component epoxy requires no...

Read More »
Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling
Repair Compounds

Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling

Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.Â-  EP38CL cures at room temperature or more quickly at elevated temperatures and has low shrinkage upon...

Read More »
Thermally Conductive Epoxy serves applications up to 572°F.
Potting Services

Thermally Conductive Epoxy serves applications up to 572°F.

Used for bonding, potting, tooling, and molding, Aremco-Bond™ 805 adheres to high-temperature plastics, glass, ceramic, and high-expansion metals. This 2-component, 100% solids, aluminum-filled epoxy cures at room temperature in 24 hr withÂ- final cure at 200°F in 2 hr. Cured material exhibits thermal conductivity of 12.5 Btu-in/hr-ft²-°F and dielectric strength...

Read More »
Encapsulants

Epoxy Potting Compound provides chemical resistance.

Stable from -55 to 200°CÂ- for potting applications, EPOXICAST EC-1027E withstands thermal cycling and thermal shock, and does not shrink, crack, or delaminate under extreme conditions. Product also provides resistance to ammonia related electrical shorting of encapsulated sensors. Two-part, heat cure only compound comes in various sizes ranging from pint kits to 5-gallon kits.

Read More »
Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity
Epoxies

Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity

Formulated with a silver coated nickel filler, Master Bond EP79FL is a two part, electrically conductive epoxy for bonding, sealing and coating applications. It has low volume resistivity of less than 0.005 ohm-cm and is suitable for a variety of uses in the electronic, aerospace, computer, semiconductor and electro-optic industries. In addition to its electrical properties, this system is very...

Read More »

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers