Press Release Summary:
With hardness rating of 84 and rated viscosity of 60,000 cps, DIEBOND 4460 resists temperatures to 110Â°C. Solvent-free, 2-component, 100% epoxy system cures overnight at room temperature or in 1.5-2.5 hr @ 50Â°C to form low stress bonds with various substrates. Minimal out-gassing occurs in applications with temperatures up to 200Â°C. System is available in bulk packaging as 2-component kit, in pre-measured MIXPAC cartridges, or in pre-mixed and frozen syringes.
Original Press Release:
DIEBOND 4460 Product
Electronic Materials Inc. announces the release of a new, high temperature resistant, two-component epoxy system. DIEBOND 4460 is a 100% epoxy system that contains no solvents, and forms fast, strong, low stress bonds with a variety of substrates. It can be cured with a wide range of temperatures and exhibits excellent moisture resistance, and minimal out-gassing in applications where temperature of up to 200°C may be encountered.
Available in a variety of viscosities and colors, DIEBOND 4460, is available in bulk packaging as a two-component kit, in pre-measured MIXPAC cartridges, or in a variety of Pre-mixed and frozen syringes. For more information contact Electronic Materials Inc. at phone (970) 547-0807, fax (970) 547-0817, e-mail: firstname.lastname@example.org, Web site: www.electronicmaterialsinc.com, or write to 1814 Airport Road, Breckenridge, CO 80424.