10-3062 Suitable for Food Packaging Industry
10-3062 Epoxy Great for Sealing and Bonding CRANSTON, RI USA — 10-3062, by Epoxies, Etc., is a two component epoxy compound that is easy to use and a good solution for applications where proper handling of wet or dry food materials is important.Â- 10-3062 meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw...
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Application Is a Breeze with Convenient Syringe Packaging
CRANSTON, RI USA – Odorless, Strong Bonding UV Adhesive Made Easy to Use 60-7158, a UV Curable Epoxy Adhesive, is specially formulated for excellent adhesion to rigid substrates.Â- Its high thixotropic index ensures the material stays in place, making it a great choice for glob top or other applications where flow control is important. 60-7158 is available in syringes making...
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Not Your Typical Flame Retardant
CRANSTON, RI USA – You’ll Wish Every Thermally Conductive Compound Was This Easy To Use... But you won't have to... because 50-3152FR has everything you look for in a Thermally Conductive Potting Compound.Â-  Aside from offering fast heat dissipation and stability during thermal cycling, 50-3152FR has some exceptional properties that make it stand out from the rest. The...
Read More »Flooring/Wall Products target restaurant industry professionals.
Used for floor and wall resurfacing, restoration, and protection, HardCore system creates durable floors and walls over new or damaged concrete and other substrates. System includes application of 5 products in various combinations: HardShield water-based, clear epoxy sealer; HardFlor heavy-duty, Â-¼ in. bonded industrial flooring surfaces; HardCote customizable coating for walls; HardCure...
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There's More to Plating than You Zinc!
To find out more about the seven demands you should make of your zinc plater, download now.
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Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications
Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures. With a Shore D hardness...
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Silver-Filled Epoxy Adhesive suits applications up to 480°F.
Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product...
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Epoxy Adhesive suits microelectronic assembly applications.
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing,Â- non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip...
Read More »Dimensionally Stable Two Component Urethane Modified Epoxy Gel Is Thermally Conductive
Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is aÂ- soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for bonding and sealing as it adheres well to a variety of substrates including metals, glass, ceramics and many rubbers and plastics. With a low...
Read More »Non-Sag, Thermally Conductive Epoxy Adhesive
With thick paste consistency, Epoxyset's EB-403-1LV-T1 bonds to diverse substrates including metals, composites, glass, ceramics, rubbers, plastics and will not run or sag even when applied to vertical surfaces even at elevated temperatures. Bonds resist thermal cycling, autoclave, as well as chemicals, including water, oils, fuels, acids, bases, and salts. This one component epoxy requires no...
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Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling
Master Bond EP38CL was developed for bonding, sealing, coating and encapsulation applications that require toughness and durability. With a Shore D hardness exceeding 75, its toughness is a unique property that imparts resistance to rigorous thermal cycling, impact and mechanical shock.Â- EP38CL cures at room temperature or more quickly at elevated temperatures and has low shrinkage upon...
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TPA Motion Introduces Industry's First Compact Robotic Positioner for Medical Devices
TPA Motion's microplate handling robots are designed specifically for medical instruments and lab automation devices. Check out the video to learn more.
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