Epoxies

Epoxy works with difficult-to-bond metals.

Epoxy works with difficult-to-bond metals.

TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75Â-

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Epoxy Film features high electrical conductivity.

Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is...

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Epoxy Adhesive suits bicycle building applications.

Epoxy Adhesive suits bicycle building applications.

Gap filling, sag resistant Araldite 2015 epoxy securely joins dissimilar materials used in fabricating bike accessories. It attains handling strength after 4 hours at room temperature and produces joints with lap shear strength of 3,200 psi at room temperature. Epoxy dispenses, waste-free, from 50 ml, dual barrel cartridges and handles temperatures from -67 to 250Â-

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Materials are offered in varying densities for design work.

Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÂ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284Â-ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ftÂ-³ density and 27 Shore D hardness. Suited for milling foundry patterns and...

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Water-Based Epoxy suits industrial/marine applications.

Water-Based Epoxy suits industrial/marine applications.

Fast Clad(TM) DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4-6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77Â-ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water,...

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Epoxy Adhesive offers high flexibility.

Epoxy Adhesive offers high flexibility.

Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30-40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is...

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Activated Epoxy bonds dissimilar materials.

Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400Â-

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Epoxy encapsulates microelectronic chips.

Epoxy encapsulates microelectronic chips.

TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.

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