Epoxy works with difficult-to-bond metals.
TRA-BOND 868-6N3 bonds to gold, silver, copper, brass, and solder with aluminum-to-aluminum lap shear of 4,600 psi. Thixotropic properties allow it to hold its shape once applied to substrate. Epoxy cures 15 min at 75Ã-
Read More »Epoxy Film features high electrical conductivity.
Silver conductive epoxy film and preform system, FL901S bonds to both similar and dissimilar substrates. It offers moisture, chemical, vibration, and shock resistance. Product cures quickly at moderately elevated temperatures and can be stored in refrigerator for 6 months. Low level of total ionic impurities of less than 50 ppm makes it suitable for electronic assembly applications. FL901S is...
Read More »Thermally Conductive Epoxy suits heat exchange applications.
Aremco-Bond(TM) 568 2-part, 1:1 mix, aluminum-filled epoxy system provides mechanical strength and thermal conductivity to 400Ã-
Read More »Epoxy Adhesive suits bicycle building applications.
Gap filling, sag resistant Araldite 2015 epoxy securely joins dissimilar materials used in fabricating bike accessories. It attains handling strength after 4 hours at room temperature and produces joints with lap shear strength of 3,200 psi at room temperature. Epoxy dispenses, waste-free, from 50 ml, dual barrel cartridges and handles temperatures from -67 to 250Ã-
Read More »The Importance of Sustainability in Rigid Plastic Packaging Manufacturing
Want to learn more about sustainable rigid plastic packaging? Ask the experts at CMG Plastics! We've got extensive experience in helping to bring rigid plastic products to market through complete custom plastic injection molding and blow molding services.
Read More »Adhesive/Sealent has temperature range of -300 to +300-
Master Bond Polymer System Supreme 10HTFL one component, flexible, epoxy resin based adhesive/sealant cures to flexible thermoset polymer at temperatures of 250-300Ã-
Read More »Materials are offered in varying densities for design work.
Medium Density Epoxy SRP boards, used for creating design models, have 42 lb/ftÃ-³ density and 68 Shore D hardness. Resistant to organic solvents, they offer heat resistance greater than 284Ã-ºF. Used for creating styling models or negative molds for casting, Ultra Low Density Urethane SRP boards have 15 lb/ftÃ-³ density and 27 Shore D hardness. Suited for milling foundry patterns and...
Read More »Water-Based Epoxy suits industrial/marine applications.
Fast Clad(TM) DTM, single-coat, direct-to-metal epoxy finish, provides high film build in one coat of 4-6 mils dry film thickness. Product dries to tough gloss finish, providing corrosion and chemical resistance as well as weathering protection. Applied at 77Ã-ºF, it dries to touch in 45 min and is dry to handle in 4 hr. Low-odor coating meets VOC and HAPS requirements, cleans up with water,...
Read More »Epoxy Adhesive offers high flexibility.
Type EP51FL 2-component, epoxy resin features 1:1 mixing ratio and cures rapidly at room temperature with setup time of 30-40 min. Epoxy is 100% reactive and no solvents or volatiles are emitted during cure. It can withstand thermal and mechanical shocks. Cured compound exhibits peel strength of more than 25 pli, elongation of >125%, and tensile strength of 1,150 psi. Mixed viscosity is...
Read More »Activated Epoxy bonds dissimilar materials.
Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400Ã-
Read More »Epoxy encapsulates microelectronic chips.
TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.
Read More »More performance and functionality for Sinumerik 828D CNC
Siemens new SINUMERIK 828D ADVANCED, SINUMERIK 828D and SINUMERIK 828D BASIC sets the standard for productivity enhancements of turning and milling operations on standardized machines and simplify the automation of grinding machines. See our video to learn all about it.
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