Thermally Conductive Epoxy suits heat exchange applications.

Press Release Summary:

Aremco-Bond(TM) 568 2-part, 1:1 mix, aluminum-filled epoxy system provides mechanical strength and thermal conductivity to 400°F, making it suitable for bonding aluminum and copper heaters and heat sinks. Thermal conductivity is 9.0 Btu-in./hr-ft²-°F, and flexural and tensile strength is 11,400 and 2,500 psi, respectively. Aremco-Bond(TM) 568 is resistant to wide range of acids, bases, salts, and organic fluids. It has passed NASA outgassing studies to ASTM E-595.

Original Press Release:

New Aremco-Bond 568 Hi-Temp Thermally Conductive Adhesive Available

Valley Cottage, NY - July 18, 2003

Aremco-Bond(TM) 568, a new high temperature, thermally conductive epoxy developed by Aremco Products, Inc., is now used to bond aluminum and copper heaters and heat sinks used in electrical, electronic and other structural heat exchange applications to 400 °F (204 °C).

Aremco-Bond(TM) 568 is an advanced, two parts, 1-to-1 mix, aluminum-filled epoxy system that provides exceptional mechanical and thermal properties to 400 °F (204 °C). Its remarkable mechanical strength and thermal conductivity make it ideal for high temperature heat exchange applications. Properties include a thermal conductivity of 9.0 Btu-in/hr-ft²-°F and a flexural and tensile strength of 11,400 and 2,500 psi, respectively, as measured by ASTM D1002-94.

Aremco-Bond(TM) 568 exhibits excellent adhesion to copper, aluminum, steel, glass, ceramic, and a variety of high temperature plastics including polyimides and composites. Aremco-Bond(TM) 568 is also resistant to a wide range of acids, bases, salts and organic fluids. Extended immersion studies have been conducted with no effect in various concentrations of hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, sodium chloride, ammonium hydroxide, sodium hydroxide, jet fuel, gasoline and toluene.

Aremco-Bond(TM) 568 has passed NASA outgassing studies according to ASTM E-595. This feature is particularly useful for aerospace manufacturers that are interested in the outgassing properties of materials. The total mass loss (TML) at 125 °C is 0.75%. The collected volatile condensable materials (CVCM) at 25 °C is 0.35%.

Aremco-Bond(TM) 568 mixes easily in a 1-to-1 ratio and cures at room temperature or by applying low heat. It is supplied in pint, quart and gallon containers as well as 50ml, 200ml and 400ml dual-barrel cartridges that can be loaded to mechanical or pneumatic guns for automatic mixing and dispensing.

For more information about this advanced epoxy formulation, please contact Aremco's Sales Engineering Department.

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