Press Release Summary:
TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.
Original Press Release:
Tra-Bond 933-2: Moisture Resistant Chip Encapsulent
TRA-CON has been a leader in the adhesive industry for over thirty years. TRA-CON understands the needs of its' customers and continues to develop products to keep up with our customers' demands. TRA-BOND 933-2 is an example of TRA-CON meeting the
special needs of its customers.
TRA-BOND 933-2 one component, highly filled, electrically insulating epoxy encapsulant is designed for encapsulating microelectronic chips. This epoxy provides excellent environmental and mechanical protection. TRA-BOND 933-2 encapsulant exhibits a longer work life and a lower moisture sensitivity than the popular anhydride-cured systems. The low coefficient of thermal expansion minimizes stress effects on
components and wiring during thermal shock tests.
To find out more about TRA-CON adhesives or to obtain samples please contact our Application Engineering group at 1-800-TRA-CON1 or visit our web-site at .tra-con.com.