Epoxies

Silver-Filled Epoxy Adhesive suits applications up to 480-

Silver-Filled Epoxy Adhesive suits applications up to 480-

Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-Â-

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Multi-Purpose Repair Epoxy offers syringe-style packaging.

To use Miracle Bond Formula in syringe style package, user twists off cap and presses plunger to dispense resin and hardener until both white and black materials flow evenly. Once dispensed onto flat disposable surface and mixed,Â- epoxy is ready for application. Adhesive system bonds concrete, brick, wood, stone, ceramics, fiberglass, metal, and some plastics. With non-sag properties,...

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Low-Viscosity Epoxy Adhesives offer fast set times.

Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of...

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Epoxy Adhesive encapsulates sensors in harsh environments.

Epoxy Adhesive encapsulates sensors in harsh environments.

Combining quartz filler and amine compound, Supreme 45HTQ is suited for bonding and encapsulating transducers, gauges, actuators, and sensors in harsh environments. Epoxy adhesive features tensile strength exceeding 8,500 psi and compressive strength greater than 20,000 psi. Resistant to chemicals, acids, oils, water, and steam, product can withstand long term exposure to 400-500Â-

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