Epoxies

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Epoxies

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume...

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Fire Sprinkler Systems Can be Restored and Protected with Epoxy
Epoxies

Fire Sprinkler Systems Can be Restored and Protected with Epoxy

PHOENIX, Jan. 29, 2019 /CNW/ -- CuraFlo Services LLC ("CuraFlo®") is pleased to announce that they have developed the only epoxy which meets or exceeds all of the stringent ICC-Listed Fire Sprinkler Pipe Systems Epoxy criteria with its proprietary CuraPoxy® FS epoxy. The listing is available at https://curaflo.com/wp-content/uploads/2018/09/ICC-ES-PMG-1491-Fire-Suppression-Certificate.pdf....

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Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5
Epoxies

Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5

The EP3UF-1 Thermally Conductive Underfill Epoxy is offered in 10 cc syringes and 30 cc syringes. The product features viscosity of 5,000-15,000 cps, compressive strength of 18,000-20,000 psi and tensile modulus of 450,000-500,000 psi. The compound exhibits thermal conductivity and resistance of 1.30-1.44 W/(m•K) and 5-7 x 10-6 K•m²/W respectively. The epoxy cures in 20-30 minutes at 250°F,...

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New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F
Epoxies

New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F

Master Bond’s EP17HTND-CCM Single Component Epoxy features a resistivity of more than 10^15 ohm-cm at 75°F and over 10^12 ohm-cm at 400°F. The compound can be used in -80°F to +600°F temperature and forms high strength bonds to substrates such as metals, ceramics, plastics, composites and circuit board materials. The material is offered in syringes with sizes ranging from 10 cc to 30 cc and...

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