Epoxy Compounds

Adhesives & Sealants

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Jan 09, 2018

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in... Read More

Adhesives & Sealants

Slideshow Offers More of 2017s New Adhesive Systems

Dec 15, 2017

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products.

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X21Med: One... Read More

Adhesives & Sealants

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500F

Dec 12, 2017

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of... Read More

Adhesives & Sealants

One Part Epoxy has Low CTE

Nov 17, 2017

Adhesive EP13LTE Passes NASA Low Outgassing

Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn’t require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance,... Read More

Adhesives & Sealants

Adhesives for Your Specific Needs

Nov 10, 2017

EP45HTAN: Thermally Conductive, Electrically Insulative Epoxy

Well suited for metal bonding especially roughened titanium, EP45HTAN is a two part epoxy paste with superior strength retention at elevated temperatures. It bonds well to a wide variety of similar/dissimilar substrates, such as multiple metals, glass, composites and many plastics. This system combines cryogenic... Read More

Adhesives & Sealants

Master Bond EP3HTSDA-1 for Die Attach Applications

Nov 03, 2017

Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing.

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Adhesives & Sealants

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Oct 31, 2017

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed... Read More

Adhesives & Sealants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Oct 26, 2017

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Adhesives & Sealants

Applications in Research Labs and Commercial Use for EP29LPSP

Oct 20, 2017

Ideal for demanding cryogenic environments, two-part EP29LPSP can withstand temperatures as low as 4K and can resist cryogenic shock when, for instance, it is cooled from room temperature to cryogenic temperatures within a 5-10 minute window. In over a dozen published research articles, patents, and manufacturers’ specifications, scientists and engineers have identified EP29LPSP for use in... Read More

Adhesives & Sealants

Master Bond EP110F8-5 Epoxy offers pot life of 2-3 days.

Oct 13, 2017

Master Bond EP110F8-5 Epoxy offers Shore D hardness of 70-80 and elongation of 40-60%. Unit is operated in a temperature range of -100°F to +300°F and is available in ½ pint, pint, quart, one and 5 gallon containers. Product provides volume resistivity more than 1015 ohm-cm, dielectric constant of 2.91 and a dissipation factor of 0.009 at 1 KHz. Master Bond EP110F8-5 can stick on metals,... Read More

Adhesives & Sealants

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life

Oct 10, 2017

Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing... Read More

Adhesives & Sealants

Finding Strongest Adhesives for Nylon Bonding

Oct 06, 2017

Lap Shear Strength of Adhesives for Nylon to Nylon Bonding

Master Bond tested the tensile lap shear strength of several epoxy products to determine their capability in nylon to nylon bonding applications. The testing produced impressive results with many systems delivering high values. While high strength is often crucial, each system also offers a diverse range of other properties that... Read More

Adhesives & Sealants

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion

Sep 19, 2017

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. “EP13LTE is very convenient to use, since it doesn’t require mixing, and has an unlimited working life at room temperature,” said Venkat Nandivada, manager of technical support. “Besides being easy to handle, this system also... Read More

Adhesives & Sealants

Epoxy System EP62-1 Featuring Superior Chemical Resistance to Harsh Chemicals

Sep 15, 2017

Master Bond EP62-1 is primarily used as an adhesive, sealant or coating. It has the ability to withstand harsh environmental conditions including exposure to acids, bases and solvents. This two part epoxy features thermal stability with a glass transition temperature exceeding 160-165°C.

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Adhesives & Sealants

Master Bond EP39MAOHT for Large Potting & Encapsulation Applications

Sep 01, 2017

EP39MAOHT blends a low viscosity and low exotherm, making it particularly well suited for large volume potting and castings. This video demonstrates this system’s mixing and flow properties. This room temperature curing system has excellent thermal conductivity and electrical insulation properties. It offers chemical resistance to water, fuels and hydraulic fluids as well as many acids and... Read More

Adhesives & Sealants

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications

Aug 29, 2017

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. “EP17HTDA-1 has the ideal viscosity and flow for die attach applications,” said Rohit Ramnath, senior product engineer. “It has a high glass transition temperature (Tg) and also offers excellent electrical insulation properties, even at elevated... Read More

Adhesives & Sealants

Supreme 3HT-80 Epoxy Adhesive can withstand thermal cycling.

Aug 26, 2017

Supreme 3HT-80 Epoxy Adhesive is effective in adhering plastics to metals or rubber to metals. The product is cured at temperature 175-180°F in 45-50 minutes. Having low stress properties, product can withstand 1,000 hours of 85°C/85% RH testing and is suitable for electronic and opto-electronic applications.

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Adhesives & Sealants

Adhesives for Your Specific Needs

Aug 25, 2017

EP29LPSPAO-1 Black: Passes NASA Low Outgassing Tests

EP29LPSPAO-1 Black is a two component, high performance epoxy system with impressive electrical insulation properties and thermal conductivity of 9-10 BTU•in/ft2 •hr•°F. It is serviceable at temperatures as low as 4K. This adhesive, sealant, coating and encapsulant is also able to withstand cryogenic shocks (i.e. room... Read More

Adhesives & Sealants

Top Five Thermally Conductive Adhesives

Aug 04, 2017

EP36AO: Flexible Epoxy for Potting and Encapsulation Applications

B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -100°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also... Read More

Adhesives & Sealants

Newly Developed Products of 2017

Jul 21, 2017

EP62-1BF: Low Viscosity Epoxy With Exceptional Chemical Resistance

EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to used for potting small components. EP62-1BF is thermally stable and has a glass... Read More