New Adhesives & Sealants Products

Hot Melt Adhesive has operating temperature of 200-

Developed for case and carton sealing applications, EASY-PAC(TM) 200Ã-

Potting Compound suits high-temperature applications.

Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365Ã-

Flame Retardant Epoxy Adhesive suits staking applications.

Thermally conductive, electrically insulating Tra-Cast LX50019 is used for staking and setting transistors, diodes, resistors, integrated circuits, and other heat-sensitive components in printed circuit electronic applications. RoHS-compliant product develops high-impact bonds at room temperature, and has coefficient of thermal expansion that makes it compatible for bonding variety of substrates...

Putty repairs and rebuilds worn metal.

Consisting of alumina-filled epoxy compound, Ceramic Repair Putty(TM) is engineered to form smooth barrier against abrasion, corrosion, cavitation, and chemical attack. Non-sagging product covers 66 sq-in./lb at thickness of Ã-¼ in. Applied with trowel, putty fills voids, protecting equipment from further damage. Pot life is 25 min, and functional cure is attained in 16 hr at room...

The Ultimate Guide to Packaging Automation Solutions

This ebook provides an in-depth guide to packaging automation solutions.

No-Mix, Structural Adhesive bonds flexible panels.

Able to fill gaps as wide as 25 mil, Flex Bond(TM) Thin Set laminates sheets of ABS or aluminum to polystyrene core and produces nonshrinking, flexible bonds on metals and plastics. Dual-component adhesive consists of methacrylate polymer and activator. Working time is 3-4 min, fixture time is 9-10 min at room temp, and full cure 2 hr. Formulated to withstand service temperatures to 200Ã-

FDA-Approved Resin is suited for microwave food packaging.

Offering freezer-to-microwave performance, DYLARKÃ-® FG 2500 styrenic copolymer provides low-temperature toughness and high-temperature rigidity that reduces danger of leakage or spillage when hot food is removed from microwave or transported. Recyclable resin, manufactured as tinted, clear, or foamed containers, can be processed on existing polystyrene or PET equipment. It is suited for...

FDA-Compliant Resin exhibits clarity and toughness.

Able to be processed on existing styrenics equipment, shatter-resistant ZYLARÃ-® EX 720 can be used to design complex parts for refrigerated or frozen food packaging. Clear acrylic copolymer enhances visibility of food inside container while protecting food in low-temperature environments such as freezers or refrigerators. Uses include fresh fruit and produce containers, salad bowls and lids,...

Conductive Adhesive suits high-vacuum, high-temperature work.

Formulated using high-purity silver flake, Aremco-Bond(TM) 556 is used to produce electronic and high-vacuum components for applications to 340Ã-

Adhesive/Sealant is 2-component, optically clear epoxy.

With 1:1 mix ratio by weight or volume, low-viscosity EP37-3FLF cures at room temperature and bonds to metal, glass, ceramic, rubber, and plastic substrates. Bonds offer resistance to impact, shock, and thermal cycling. Also usable as potting and encapsulation compound, product has service operating temperature range of -80 to +250Ã-

Flexible Epoxy Adhesive dispenses with pinpoint accuracy.

Electrically conductive, 400Ã-

What Can Test Devices Spin for You?

Test Devices helps you ensure the safety and efficiency of your high performance machines with cutting edge spin testing, rotor engineering, and precision balancing capabilities. Check out the video to learn more.